Abstract: A trisamide compound has the structure of Formula (I) in which R1, R2, and R3 are independently selected from the group consisting of alkyl groups. A polymer composition comprises a trisamide compound of Formula (I) and a polyolefin polymer. The polymer compositions containing a trisamide compound of Formula (I) exhibit very low haze levels and minimal extraction of the trisamide compound.

Abstract: A trisamide compound has the structure of Formula (I) in which R1, R2, and R3 are independently selected from the group consisting of alkyl groups. A polymer composition comprises a trisamide compound of Formula (I) and a polyolefin polymer. The polymer compositions containing a trisamide compound of Formula (I) exhibit very low haze levels and minimal extraction of the trisamide compound.

Abstract: Thermoplastic polymer compositions (P) comprising 90 to 99.9 wt.-% of at least one styrene-based copolymer, 0.1 to 10 wt.-% of at least one copolymer at least comprising repeating units derived from at least one ?-olefin monomer and at least one vinyl-aromatic monomer, at least one inorganic phosphate compound, at least one polyolefin wax and optionally at least one colorant, dye or pigment, and/or at least one further additive show improved properties with respect to residual gloss after abrasion combined with improved melt flow characteristics while heat resistance is not affected.

Abstract: A thermoplastic molding composition can be employed for 3D printing if it comprises: A: 92.9 to 98.59 wt % of impact-modified polymer A, consisting of: 40 to 90 wt % of vinylaromatic copolymer a, 10 to 60 wt % of ABS graft copolymer b; B1: 1.2 to 3.5 wt % of amide or amide derivative of saturated higher fatty acid having 14 to 22 carbon atoms; B2: 0.2 to 0.6 wt % of salt of saturated higher fatty acid having 14 to 22 carbon atoms; and C: 0.01 to 3 wt % of auxiliaries C such as stabilizers, oxidation retarders, agents against heat and UV light decomposition.

Abstract: Thermally conductive polymer (TCP) resin compositions are described, comprising components (X) and (Y): 90 to 99.9% component (X) comprising components (I) and (II): 60 to 85% matrix polymer (I) comprising styrenic polymers (F) selected from: ABS resins, ASA resins, and elastomeric block copolymers of the structure (S—(B/S))n—S; 15 to 40% thermally conductive filler material (II) (D50 1 to 200 ???), consisting of a ceramic material and/or graphite; 0.1 to 10% chemical foaming agent (Y). Shaped articles made thereof can be used for automotive applications, as a heat sink for high performance electronics, LED sockets or electrical and electronic housings.

Abstract: Provided are trisamide compounds and compositions containing the same. In an embodiment, the trisamides are represented by the following formula: wherein R1 represents a univalent group other than hydrogen, and X1 and X2 represent independently selected univalent groups.

Abstract: Thermoplastic moulding composition for 3D printing containing a polymer mixture A made of components a and b: a being from 30 to 95% by weight of at least one vinylaromatic copolymer a with average molar mass Mw from 150 000 to 360 000 g/mol, b being from 5 to 70% by weight of at least one impact modifier b, where the viscosity of the moulding composition (measured in accordance with ISO 11443) at shear rates of from 1 to 10 l/sec and at a temperature of 250° C. is not higher than 1×105 Pa*s and the Melt Volume Rate (MVR, measured in accordance with ISO 1133 for 220° C. and 10 kg load) is more than 6 ml/10 min.

Abstract: Use of transition metal complexes of the formula (I) in organic light-emitting diodes where: M1 is a metal atom; carbene is a carbene ligand; L is a monoanionic or dianionic ligand; K is an uncharged monodentate or bidentate ligand selected from the group consisting of phosphines; CO; pyridines; nitriles and conjugated dienes which form a ? complex with M1; n is the number of carbene ligands and is at least 1; m is the number of ligands L, where m can be 0 or ?1; o is the number of ligands K, where o can be 0 or ?1; where the sum n+m+o is dependent on the oxidation state and coordination number of the metal atom and on the denticity of the ligands carbene, L and K and also on the charge on the ligands carbene and L, with the proviso that n is at least 1, and also an OLED comprising these transition metal complexes, a light-emitting layer comprising these transition metal complexes, OLEDs comprising this light-emitting layer, devices comprising an OLED according to the present invention, and specific

Abstract: Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers (?) such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S))n-S; and 25 to 50% thermally conductive filler material (II) (D50 0.1 to 200 ?m), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.

Abstract: A scratch-resistant thermoplastic polymer composition (P) comprising 40 to 99.9 wt.-% of at least one styrene-based copolymer, 0.1 to 20 wt.-% of at least one inorganic metal compound nanoparticle, and optionally at least one polymeric compatibilizing agent, at least one modified polysiloxane compound, at least one colorant, dye or pigment, and/or at least one further additive has improved scratch properties.

Abstract: Scratch-resistant thermoplastic polymer compositions (P) comprising 90 to 99.9 wt.-% of at least one styrene-based copolymer, 0.1 to 10 wt.-% of an aliphatic amide wax additive comprising at least one aliphatic amide wax composition having a melting point in the range of 80° C. to 115° C., and optionally at least one colorant, dye, pigment and/or further additive, have improved properties.

Abstract: Thermoplastic polymer compositions (P) comprising at least one styrene-based polymer composition (A) comprising at least one graft copolymer (A-1), at least one organopolysiloxane compound, and optionally at least one colorant, dye or pigment, and/or at least one further additive, shows improved properties with respect to residual gloss after abrasion combined with improved melt flow characteristics while heat resistance is not affected.

Abstract: A scratch-resistant thermoplastic polymer composition (P) comprising 88 to 99.9 wt.-% of at least one styrene-based copolymer, 0.1 to 5 wt.-% of at least one modified organopolysiloxane compound, and optionally at least one colorant, dye or pigment, and/or at least one further additive, provides with improved properties.

Abstract: The present invention relates to the use of transition metal-carbene complexes in organic light-emitting diodes (OLEDs), to a light-emitting layer, to a blocking layer for electrons or excitons, or to a blocking layer for holes, each comprising these transition metal-carbene complexes, to OLEDs comprising these transition metal-carbene complexes, to devices which comprise an inventive OLED, and to transition metal-carbene complexes.

Abstract: The invention relates to the use of a thermoplastic moulding compound for 3D Printing, made of a mixture of the following components A-E: A: 35-60 wt. % impact resistant modified polymer A comprising: 30-95 wt. % SAN-copolymer and 5-70 wt. % ABS-graft copolymer; B: 33-58 wt. % aliphatic polyamide B; C: 1-10 wt. % SANMSA-terpolymer C as a compatibilizing agent; D: 0.01-5 wt. % processing agent D; and E: 0-30 wt. % other additives E.

Abstract: Use of transition metal complexes of the formula (I) in organic light-emitting diodes where: M1 is a metal atom; carbene is a carbene ligand; L is a monoanionic or dianionic ligand; K is an uncharged monodentate or bidentate ligand selected from the group consisting of phosphines; CO; pyridines; nitriles and conjugated dienes which form a ? complex with M1; n is the number of carbene ligands and is at least 1; m is the number of ligands L, where m can be 0 or ?1; o is the number of ligands K, where o can be 0 or ?1; where the sum n+m+o is dependent on the oxidation state and coordination number of the metal atom and on the denticity of the ligands carbene, L and K and also on the charge on the ligands carbene and L, with the proviso that n is at least 1, and also an OLED comprising these transition metal complexes, a light-emitting layer comprising these transition metal complexes, OLEDs comprising this light-emitting layer, devices comprising an OLED according to the present invention, and specific tr

Abstract: The present invention relates to the use of transition metal-carbene complexes in organic light-emitting diodes (OLEDs), to a light-emitting layer, to a blocking layer for electrons or excitons, or to a blocking layer for holes, each comprising these transition metal-carbene complexes, to OLEDs comprising these transition metal-carbene complexes, to devices which comprise an inventive OLED, and to transition metal-carbene complexes.

Abstract: Embodiments of a polyethylene composition comprise at least 50% by wt. of at least one polyethylene polymer; and 0.001 to 2% by wt. of bisamide nucleating agent utilized to reduce haze within the polyethylene composition.

Abstract: The invention relates to the use of a thermoplastic moulding compound for 3D Printing, made of a mixture of the following components A-E: A: 35-60 wt. % impact resistant modified polymer A comprising: 30-95 wt. % SAN-copolymer and 5-70 wt. % ABS-graft copolymer; B: 33-58 wt. % aliphatic polyamide B; C: 1-10 wt. % SANMSA-terpolymer C as a compatibilizing agent; D: 0.01-5 wt. % processing agent D; and E: 0-30 wt. % other additives E.

Abstract: A thermoplastic molding composition can be employed for 3D printing if it comprises: A: 92.9 to 98.59 wt % of impact-modified polymer A, consisting of: 40 to 90 wt % of vinylaromatic copolymer a, 10 to 60 wt % of ABS graft copolymer b; B1: 1.2 to 3.5 wt % of amide or amide derivative of saturated higher fatty acid having 14 to 22 carbon atoms; B2: 0.2 to 0.6 wt % of salt of saturated higher fatty acid having 14 to 22 carbon atoms; and C: 0.01 to 3 wt % of auxiliaries C such as stabilizers, oxidation retarders, agents against heat and UV light decomposition.