Patents by Inventor Hantaro OZAWA

Hantaro OZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module and power conversion device
    Patent number: 11710685
    Abstract: The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: July 25, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Dai Yoshii, Hantaro Ozawa
  • SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
    Publication number: 20210175158
    Abstract: The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.
    Type: Application
    Filed: October 27, 2020
    Publication date: June 10, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Dai YOSHII, Hantaro OZAWA