Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: The present disclosure provides a method and a system for identifying mobile device according to information feature of applications of the mobile device. In an analysis device, obtaining a first information feature related to a first application and a second information feature related to a second application, wherein the first information feature is corresponding to one of the mobile devices, the second information feature is corresponding to one of the mobile devices. The analysis device compares the degree of similarity between the first information feature and the second information feature, and a comparison result determines whether the corresponding mobile device with the first information feature and the corresponding mobile device with the second information feature are the same mobile device. Thus, the method and the system can identify whether or not certain applications are already installed to the same mobile device.

Abstract: An information recommend system includes an information recommend device. The information recommend device is configured to store a operation model and a recommendation model. The operation model is composed of a plurality of operation mode data, and the recommendation model is composed of detailed data of a plurality of multimedia data. The information recommend device is further configured to receive a plurality of real-time viewing data, determine a real-time operation mode according to the real-time viewing data and the operation model, and determine recommending multimedia data and a time point for recommending form the detailed data of the multimedia data according to the real-time operation mode and the recommendation model.

Abstract: A system for automatically embedding behavior collection components into a mobile device application; the system includes a user interface module, a recording module, a marking module, and an embedding module. The user interface module provides an operation interface which includes tracking items. The tracking items correspond to behavior collection components. The behavior collection components transmit operation information of the mobile device to a server. The recording module records relational information respectively corresponds to each of the behavior collection components, and each relational information is a relational function selected from of a plurality of relational functions of a library. The marking module determines and marks embedding positions of the behavior collection components in the mobile device application based on the behavior collection components of the selected tracking items and relational information thereof.

Abstract: A device, a system, a method and a non-transitory computer-readable storage medium for identifying viewer profile are disclosed herein, in which the device includes a database, an input unit and a processing unit, and the processing unit is electrically coupled to the database and the input unit. The database is configured to store a plurality of viewer profiles. The input unit is configured to receive a plurality of real-time viewing data. The processing unit is configured to determine a real-time viewer profile according to the viewer profiles and the real-time viewing data.

Abstract: The present disclosure provides a method and a system for identifying mobile device according to information feature of applications of the mobile device. In an analysis device, obtaining a first information feature related to a first application and a second information feature related to a second application, wherein the first information feature is corresponding to one of the mobile devices, the second information feature is corresponding to one of the mobile devices. The analysis device compares the degree of similarity between the first information feature and the second information feature, and a comparison result determines whether the corresponding mobile device with the first information feature and the corresponding mobile device with the second information feature are the same mobile device. Thus, the method and the system can identify whether or not certain applications are already installed to the same mobile device.

Abstract: A system for automatically embedding behavior collection components into a mobile device application; the system includes a user interface module, a recording module, a marking module, and an embedding module. The user interface module provides an operation interface which includes tracking items. The tracking items correspond to behavior collection components. The behavior collection components transmit operation information of the mobile device to a server. The recording module records relational information respectively corresponds to each of the behavior collection components, and each relational information is a relational function selected from of a plurality of relational functions of a library. The marking module determines and marks embedding positions of the behavior collection components in the mobile device application based on the behavior collection components of the selected tracking items and relational information thereof.

Abstract: A method of removing silicon dioxide from a waste liquid is described. A solution containing fluoride ions is added into the waste liquid to form a reaction product. A method of cleaning a membrane tube for processing waste water is also described, wherein the membrane tube contains residues of waste water that include a first residue and a second residue containing silicon dioxide. A first cleaning step is conducted to reduce the concentration of the first residue in the membrane tube to a first concentration. A solution containing fluoride ions is added into the tube to react with the second residue to form a reaction product. A second cleaning step is then conducted to reduce the concentration of the residual fluorine ions in the membrane tube to a second concentration.

Abstract: A method of removing silicon dioxide from a waste liquid is described. A solution containing fluoride ions is added into the waste liquid to form a reaction product. A method of cleaning a membrane tube for processing waste water is also described, wherein the membrane tube contains residues of waste water that include a first residue and a second residue containing silicon dioxide. A first cleaning step is conducted to reduce the concentration of the first residue in the membrane tube to a first concentration. A solution containing fluoride ions is added into the tube to react with the second residue to form a reaction product. A second cleaning step is then conducted to reduce the concentration of the residual fluorine ions in the membrane tube to a second concentration.