Patents by Inventor Hao-Chun Hsieh
Hao-Chun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113071Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
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Patent number: 11941157Abstract: A computer implemented method for managing the scope of permissions granted by users to application that includes collecting a set of permissions for an application from an application provider publication; and collecting a process flow for functional steps of the application from a review of the application that is published on a product review type publication. The computer implemented method further includes dividing the functional steps of the application into a plurality of journeys, each of said plurality of journeys having a function associated with a stage of a functional step from a perspective of a user; and matching permissions from the set of permissions for each journey of said plurality of journeys to provide matched permissible permissions to journeys stored in a customer journey store.Type: GrantFiled: December 16, 2020Date of Patent: March 26, 2024Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hao Chun Hung, Po-Cheng Chiu, Tsai-Hsuan Hsieh, Cheng-Lun Yang, Chiwen Chang, Shin Yu Wey
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Patent number: 11935871Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.Type: GrantFiled: August 30, 2021Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
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Patent number: 9810582Abstract: A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.Type: GrantFiled: October 8, 2014Date of Patent: November 7, 2017Assignee: Wistron CorporationInventors: Hao-Chun Hsieh, Hsin-Lun Tsai, Kaun-Chang Wu
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Patent number: 9699911Abstract: A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.Type: GrantFiled: September 4, 2014Date of Patent: July 4, 2017Assignee: Wistron CorporationInventors: Hao-Chun Hsieh, Chang-Lung Chen, Sheng-Wen Cheng, Pi-Chiang Huang
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Patent number: 9591794Abstract: The disclosure provides a feeder system, for providing multiple materials from a tube, including a transportation platform and a material guiding carrier. The material guiding carrier is mounted on the transportation platform. The material guiding carrier includes a material input portion and a material output portion. A material output opening of the tube is located at the material input portion. The materials from the tube are conveyed to the material guiding carrier by the transportation platform. At least two guiding members are mounted on the material guiding carrier for matching the tube in an adjustable manner to guide the materials from the material input portion to the material output portion along a material feeding direction. The material feeding direction and an arrangement of the at least two guiding members are parallel to each other.Type: GrantFiled: May 21, 2014Date of Patent: March 7, 2017Assignee: WISTRON CORP.Inventors: Hao-Chun Hsieh, Chang-Lung Chen, Pi-Chiang Huang
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Publication number: 20150334888Abstract: A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.Type: ApplicationFiled: September 4, 2014Publication date: November 19, 2015Inventors: Hao-Chun Hsieh, Chang-Lung Chen, Sheng-Wen Cheng, Pi-Chiang Huang
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Publication number: 20150323393Abstract: A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.Type: ApplicationFiled: October 8, 2014Publication date: November 12, 2015Inventors: Hao-Chun Hsieh, Hsin-Lun Tsai, Kaun-Chang Wu
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Publication number: 20150195962Abstract: The disclosure provides a feeder system, for providing multiple materials from a tube, including a transportation platform and a material guiding carrier. The material guiding carrier is mounted on the transportation platform. The material guiding carrier includes a material input portion and a material output portion. A material output opening of the tube is located at the material input portion. The materials from the tube are conveyed to the material guiding carrier by the transportation platform. At least two guiding members are mounted on the material guiding carrier for matching the tube in an adjustable manner to guide the materials from the material input portion to the material output portion along a material feeding direction. The material feeding direction and an arrangement of the at least two guiding members are parallel to each other.Type: ApplicationFiled: May 21, 2014Publication date: July 9, 2015Applicant: Wistron Corp.Inventors: Hao-Chun HSIEH, Chang-Lung CHEN, Pi-Chiang HUANG
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Patent number: 8740046Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.Type: GrantFiled: January 8, 2014Date of Patent: June 3, 2014Assignee: Wistron CorporationInventors: Hao-Chun Hsieh, Chia-Hsien Lee
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Publication number: 20140110458Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.Type: ApplicationFiled: January 8, 2014Publication date: April 24, 2014Applicant: Wistron CorporationInventors: Hao-Chun Hsieh, Chia-Hsien Lee
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Patent number: 8690041Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.Type: GrantFiled: December 13, 2011Date of Patent: April 8, 2014Assignee: Wistron CorporationInventors: Hao-Chun Hsieh, Chia-Hsien Lee
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Patent number: 8656583Abstract: A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.Type: GrantFiled: January 31, 2013Date of Patent: February 25, 2014Assignee: Wistron CorporationInventors: Jun-Min Yang, Hao-Chun Hsieh, Hsin-Lun Tsai, Chia-Hsien Lee
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Patent number: 8556154Abstract: A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.Type: GrantFiled: February 20, 2013Date of Patent: October 15, 2013Assignee: Wistron CorporationInventors: Hao-Chun Hsieh, Chia-Hsien Lee
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Publication number: 20130240608Abstract: A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.Type: ApplicationFiled: February 20, 2013Publication date: September 19, 2013Applicant: WISTRON CORPORATIONInventors: Hao-Chun Hsieh, Chia-Hsien Lee
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Patent number: 8462520Abstract: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.Type: GrantFiled: June 16, 2010Date of Patent: June 11, 2013Assignee: Wistron CorporationInventors: Hao-Chun Hsieh, Hsien-Min Chen, Chia-Hsien Lee
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Patent number: 8387233Abstract: A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.Type: GrantFiled: January 27, 2010Date of Patent: March 5, 2013Assignee: Wistron CorporationInventors: Jun-Min Yang, Hao-Chun Hsieh, Hsin-Lun Tsai, Chia-Hsien Lee
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Publication number: 20120261870Abstract: A printed circuit board, a supporting jig, and a positioning method are disclosed, wherein the supporting jig is used for positioning a printed circuit board to facilitate surface mount technology (SMT) procedures. The printed circuit board includes a circuit board locating hole, and a first magnet, wherein the first magnet is accommodated in the circuit board locating hole. The supporting jig has a jig locating hole and a second magnet. The jig locating hole is beneath the circuit board locating hole. The second magnet is accommodated in the jig locating hole so that the printed circuit board can be fixed on the supporting jig by the magnetic attraction between the first magnet and the second magnet.Type: ApplicationFiled: April 11, 2012Publication date: October 18, 2012Applicant: Wistron CorporationInventors: Hao-Chun HSIEH, Sheng-Wen Cheng, Hsin-Lun Tsai, Chia-Hsien Lee
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Publication number: 20120193400Abstract: A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.Type: ApplicationFiled: December 13, 2011Publication date: August 2, 2012Inventors: Hao-Chun Hsieh, Chia-Hsien Lee
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Publication number: 20120090652Abstract: The cleaning apparatus for solder paste in apertures according to the present invention comprises a stencil, a guiding plate, and a blower. The stencil has a plurality of apertures with residual solder paste on the sidewalls thereof. The guiding plate is disposed above the stencil and has a plurality of wind-guiding pillars and a plurality of wind-guiding holes. The locations of the wind-guiding pillars are opposite to the locations of the apertures; the wind-guiding holes are located around the wind-guiding pillars. The blower is disposed above the guiding plate and provides a gas to the guiding plate. The gas is guided into the apertures by means of the wind-guiding pillars and the wind-guiding holes and pushes completely the solder paste therein out. Thereby, accumulation of solder paste in the sidewalls of the apertures can be avoided. Consequently, deterioration of adhesion of electronic components caused by fewer amount of solder paste printed on the carrier can be prevented.Type: ApplicationFiled: May 23, 2011Publication date: April 19, 2012Applicant: Wistron CorporationInventors: Hao-Chun HSIEH, Hsin-Lun Tasi, Chia-Hsien Lee