Patents by Inventor Hao-Juin Liu
Hao-Juin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11088102Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: GrantFiled: November 4, 2019Date of Patent: August 10, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Patent number: 10867810Abstract: A method includes forming a plurality of vias in a dielectric layer and over a package substrate and forming a plurality of top pads over the dielectric layer, each of the plurality of top pads being connected to a respective via of the plurality of vias, wherein the plurality of top pads includes a first group, a second group, a third group and a fourth group, wherein the first group is separated from the fourth group by a first pad line, wherein the first group is separated from the second group by a second pad line, the first pad line comprising a plurality of first elongated pads, the second pad line comprising a plurality of second elongated pads, the second pad line being orthogonal to the first pad line.Type: GrantFiled: September 13, 2019Date of Patent: December 15, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Patent number: 10748785Abstract: A device includes a plurality of first pads in a package substrate, wherein at least one first pad is of a first elongated shape, a plurality of vias in a dielectric layer and over the plurality of first pads, and a plurality of second pads over the package substrate, wherein at least one second pad is of a second elongated shape, and wherein the plurality of second pads is over a top surface of the dielectric layer and placed in a first region, a second region, a third region and a fourth region, and wherein second pads in two contiguous regions are oriented in two different directions.Type: GrantFiled: August 17, 2017Date of Patent: August 18, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Publication number: 20200098714Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: ApplicationFiled: November 4, 2019Publication date: March 26, 2020Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Publication number: 20200013710Abstract: A method includes forming a plurality of vias in a dielectric layer and over a package substrate and forming a plurality of top pads over the dielectric layer, each of the plurality of top pads being connected to a respective via of the plurality of vias, wherein the plurality of top pads includes a first group, a second group, a third group and a fourth group, wherein the first group is separated from the fourth group by a first pad line, wherein the first group is separated from the second group by a second pad line, the first pad line comprising a plurality of first elongated pads, the second pad line comprising a plurality of second elongated pads, the second pad line being orthogonal to the first pad line.Type: ApplicationFiled: September 13, 2019Publication date: January 9, 2020Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Patent number: 10468366Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: GrantFiled: June 6, 2017Date of Patent: November 5, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Patent number: 10037973Abstract: A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the conductive pad is coupled with a circuitry of the semiconductor substrate. A patterned passivation layer exposing a portion of the conductive pad is formed. An uneven surface of the conductive pad is formed. A photoresist is formed on the semiconductor substrate. The photoresist is exposed under a light beam, wherein the light beam is scattered by the uneven surface. The photoresist is developed to form an opening in the photoresist so as to expose the conductive pad and form a plurality of cavities in the remaining photoresist. A conductive material is formed in the opening and the plurality of cavities.Type: GrantFiled: July 15, 2016Date of Patent: July 31, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng, Chita Chuang
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Patent number: 9978656Abstract: The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a molding layer with a Young's modulus (or a harder material) higher than polyimide. The copper post structures formed greatly reduce the risk of cracking of passivation layer and delamination of at the dielectric interface surrounding the copper post structures.Type: GrantFiled: February 27, 2012Date of Patent: May 22, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Shu Lin, Han-Ping Pu, Ming-Da Cheng, Chang-Chia Huang, Hao-Juin Liu
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Publication number: 20170345677Abstract: A device includes a plurality of first pads in a package substrate, wherein at least one first pad is of a first elongated shape, a plurality of vias in a dielectric layer and over the plurality of first pads, and a plurality of second pads over the package substrate, wherein at least one second pad is of a second elongated shape, and wherein the plurality of second pads is over a top surface of the dielectric layer and placed in a first region, a second region, a third region and a fourth region, and wherein second pads in two contiguous regions are oriented in two different directions.Type: ApplicationFiled: August 17, 2017Publication date: November 30, 2017Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Publication number: 20170271291Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: ApplicationFiled: June 6, 2017Publication date: September 21, 2017Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Patent number: 9741589Abstract: A structure comprises a plurality of top pads protruding over a top surface of a package substrate, wherein a top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion, a plurality of bottom pads embedded in the package substrate, wherein a bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion and a plurality of vias coupled between the top pads and their respective bottom pads.Type: GrantFiled: July 10, 2015Date of Patent: August 22, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Patent number: 9673125Abstract: A structure comprises a first passivation layer formed over a substrate, a second passivation layer formed over the first passivation layer, wherein the second passivation layer includes a first opening with a first dimension, a bond pad embedded in the first passivation layer and the second passivation layer, a protection layer formed on the second passivation layer comprising a second opening with a second dimension, wherein the second dimension is greater than the first dimension and a connector formed on the bond pad.Type: GrantFiled: October 30, 2012Date of Patent: June 6, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang, Yu-Jen Tseng, Chen-Shien Chen
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Patent number: 9673161Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: GrantFiled: July 18, 2016Date of Patent: June 6, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Publication number: 20160336298Abstract: A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the conductive pad is coupled with a circuitry of the semiconductor substrate. A patterned passivation layer exposing a portion of the conductive pad is formed. An uneven surface of the conductive pad is formed. A photoresist is formed on the semiconductor substrate. The photoresist is exposed under a light beam, wherein the light beam is scattered by the uneven surface. The photoresist is developed to form an opening in the photoresist so as to expose the conductive pad and form a plurality of cavities in the remaining photoresist. A conductive material is formed in the opening and the plurality of cavities.Type: ApplicationFiled: July 15, 2016Publication date: November 17, 2016Inventors: HUA-WEI TSENG, SHANG-YUN TU, HSU-HSIEN CHEN, HAO-JUIN LIU, CHEN-SHIEN CHEN, MING HUNG TSENG, CHITA CHUANG
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Publication number: 20160329293Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: ApplicationFiled: July 18, 2016Publication date: November 10, 2016Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Patent number: 9472521Abstract: A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second diameter, wherein the first diameter is greater than the second diameter by a first distance of about 10 ?m. In another embodiment, an underbump metallization is formed through the opening, and the underbump metallization has a third diameter that is greater than the first diameter by a second distance of about 5 ?m. In yet another embodiment, a sum of the first distance and the second distance is greater than about 15 ?m.Type: GrantFiled: November 2, 2012Date of Patent: October 18, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yao-Chun Chuang, Chita Chuang, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen
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Patent number: 9406629Abstract: A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.Type: GrantFiled: October 15, 2014Date of Patent: August 2, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng, Chita Chuang
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Patent number: 9397059Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: GrantFiled: August 31, 2015Date of Patent: July 19, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Publication number: 20160155733Abstract: A method comprises depositing a protection layer over a first semiconductor die, forming an under bump metallization structure over the protection layer, forming a connector over the under bump metallization structure, forming a first dummy plane along a first edge of a top surface of the first semiconductor die and forming a second dummy plane along a second edge of the top surface of the first semiconductor die, wherein the first dummy plane and the second dummy plane form an L-shaped region.Type: ApplicationFiled: February 8, 2016Publication date: June 2, 2016Inventors: Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20160111384Abstract: A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.Type: ApplicationFiled: October 15, 2014Publication date: April 21, 2016Inventors: HUA-WEI TSENG, SHANG-YUN TU, HSU-HSIEN CHEN, HAO-JUIN LIU, CHEN-SHIEN CHEN, MING HUNG TSENG, CHITA CHUANG