Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: A method and system for video communications between a terminal and a server. A first terminal establishes a communication connection with a server through a communication protocol. Local video data displayed in a video zone of the first terminal and other data displayed in a preset whiteboard zone of the first terminal are sent-to the server, to allow the server to send the local video data and the other data to one or more second terminals to be displayed. Complex content can be shown in one-to-one, one-to-many or many-to-many video communications applications to satisfy the demand and experience of video communications in the scenes of chats.

Abstract: Disclosed are a method for video communications and a terminal, server and system for video communications. The method includes: a first terminal establishing a communication connection with a server by means of a communication protocol; sending local video data of the first terminal and data in a first preset whiteboard zone to the server, to allow that the server to send the local video data and the data indicated in the first preset whiteboard zone to one or more than one second terminals except the first terminal to be displayed. By proving a first preset whiteboard zone in the process of video communications and sending data in the first preset whiteboard zone among the second terminals through a server, the present invention can make complex content be shown in one-to-one, one-to-many or many-to-many video communications applications to satisfy the demand and experience of video communications in the scenes of chats.

Abstract: A method, an apparatus, and a terminal for selecting content. The method includes displaying a rail and a slider on the rail in a predetermined region of a display screen, the rail including at least one rail segment and each rail segment corresponding to one list content; receiving a first sliding signal for controlling the slider; and sliding the slider on the rail based on the first sliding signal and performing selection operation or selection-clearing operation on the list content corresponding to the rail segments through which the slider passes during its sliding. With the configurations of the present disclosure, a plurality of list contents are selected in batch or such selection is cleared in batch by sliding the slider only once or by sliding a few times.