Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: A shave ice device having a first compartment, a second compartment below the first compartment, a gripping mechanism for gripping a block of ice, a rotating mechanism for rotating the gripping mechanism, a shaving plate separating the first compartment from the second compartment, and a cooling mechanism in communication with the first compartment. The cooling mechanism maintains the temperature of the first compartment at about 0 degrees Celsius or lower.

Abstract: An ice cube positioning and protecting structure of an ice shaver includes a base, a transmission mechanism and a bracket. The transmission mechanism is installed on the base, and the base includes a support base screwed to a rotating rod linked by the transmission mechanism, so that the rotating rod can be moved up and down with respect to the support base. A positioning space is concavely formed on a side of the support base, and a first engaging portion is disposed on at least one side of an inner wall of the positioning space. The bracket has a second engaging portion for installing the bracket into the positioning space, and an ice containing space is concavely and downwardly formed at the bracket, and a planer and an outlet are formed at the bottom of the bracket for putting the ice cube and preventing flake ice from flying out.

Abstract: A shave ice device having a first compartment, a second compartment below the first compartment, a gripping mechanism for gripping a block of ice, a rotating mechanism for rotating the gripping mechanism, a shaving plate separating the first compartment from the second compartment, and a cooling mechanism in communication with the first compartment. The cooling mechanism maintains the temperature of the first compartment at about 0 degrees Celsius or lower.

Abstract: A method of performing chemical reactions with enhanced catalytic activity of a solid body by creating plastic deformations in the surface of the catalyst contacted by the reacting materials. The body of catalytic material is fixedly attached to a substrate or base material capable of being deformed by an electrical or magnetic field. A field is applied of sufficient intensity and proper orientation to deform the base material to an extent producing plastic deformation of the attached catalyst, thereby creating defects in the exposed surface thereof.