Abstract: A combined catalytic viscosity reducing system includes a catalyst slug, a heat generating system slug, a gas injection slug, and a water-soluble viscosity reducing system slug. The catalyst slug includes 10%-15% of azacarbene iron, 15%-30% of tert-butyl hydroperoxide, 2%-5% of phosphoric acid, 2%-5% of hydrogen donor, and 0.5%-1% of emulsifier agent, and the others are solvent. The heat generating system slug includes 10%-30% of NaNO2, 8%-25% of NH4Cl, and 3%-10% of acid initiator, and the others are water, totaling 100%. The water-soluble viscosity reducing system slug, according to mass percentage, includes 0.2%-0.5% of surfactant and 2%-10% of alkali, and the others are water. The combined catalytic viscosity reducing system can effectively reduce viscosity without injecting steam, and the viscosity reduction rate can reach 96.5%.

Abstract: A display panel and a display device are provided. The display panel includes a display region and a non-display region. The non-display region includes a demultiplexing circuit, a fanout wire, and a clock signal line. An input terminal of the demultiplexing circuit is electrically connected to the fanout wire, an output terminal of the demultiplexing circuit is electrically connected to a data line in the display region, and a control terminal of the demultiplexing circuit is electrically connected to the clock signal line. The display panel further includes an isolation signal line including an isolation portion, and an orthographic projection of the isolation portion on a plane where a substrate is located is between an orthographic projection of the clock signal line on the plane where the substrate is located and an orthographic projection of the fanout wire on the plane where the substrate is located.

Abstract: Methods, systems, and devices for wireless communications are described in which a receiving device, such as a base station or user equipment (UE), may receive an input signal that is modulated according to a probabilistic amplitude shaping (PAS) modulation technique. The receiving device may determine an associated channel noise estimate and may scale the input signal and the channel noise estimate based on a probability distribution parameter that is associated with the PAS modulation. The receiving device may demap the modulation constellation of the input signal based on the scaled input signal and the scaled channel noise estimate and provide one or more bits associated with the PAS modulated constellation. The probability distribution parameter may be estimated at the receiving device, or the transmitting device may provide the probability distribution parameter to the receiving device.

Abstract: Wireless communications systems and methods related to an efficient arithmetic coding based multiple composition distribution matcher (MCDM) are provided. A wireless communication device selects, based on a first value representing a sequence of bits, a first composition from a plurality of compositions. Each composition of the plurality of compositions includes a different modulation symbol distribution associated with a modulation scheme. The wireless communication device encodes, based on the first composition, the sequence of bits into a sequence of symbols using arithmetic coding. The wireless communication device transmits a communication signal including the sequence of symbols.

Abstract: Methods, systems, and devices for power backoff techniques for modulation schemes are described. A user equipment (UE) may receive an indication of a constellation distribution parameter and a modulation scheme to be used by the UE for an uplink message on an uplink channel. The UE may determine an uplink transmission power based at least in part on the indicated constellation distribution parameter and the indicated modulation scheme. The UE may transmit the uplink message using the indicated modulation scheme according to the determined uplink transmission power. In some examples, the UE may transmit a report indicating a power headroom parameter and an output power parameter based at least in part on the constellation distribution parameter.

Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: Disclosed are techniques, systems, apparatuses, and methods of wireless communication. In one aspect, a method of wireless communication is disclosed. The method includes transmitting, by a first communications node to a second communications node, a set of information for transmission of reference signals or channels, wherein the set of information includes: timing information related to a transmission timing of the reference signals or channels, timing information related to when an antenna group or a group of reference signals and/or channels related to the antenna group is activated, or an identification of one or more antenna groups associated with the reference signals or channels.

Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.

Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: A dynamic interface layout method includes that a width of a screen of an electronic device is divided into a plurality of columns. The electronic device displays a first interface on the screen. After detecting an interface refresh signal, the electronic device obtains a first column quantity corresponding to a width of a second interface to be displayed after refreshing. The first column quantity is a quantity of columns included in the width of the second interface. The electronic device determines a second column quantity according to a layout rule corresponding to a first element on the second interface. The second column quantity is a quantity of columns included in a width of the first element. The electronic device displays the second interface on the screen.

Abstract: A projection device includes a housing and a bracket assembly. The housing has a first side wall and a second side wall connected to each other, the first side wall has a connecting portion and a limit groove, the limit groove has a curved section and a linear section connected to each other. The second side wall has a projection hole. The bracket assembly includes an adapter and a bracket. The adapter is movably connected to the connecting portion. The bracket is pivotally connected to the adapter and has a limit post extending into the limit groove. When the limit post moves to the linear section, the adapter is adapted to move in the connecting portion and drives the limit post to move in the linear section, so the bracket can be closer to the projection hole and the effect of covering the projection hole by the bracket is improved.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: An auxiliary operation device for a droplet dispenser includes a droplet sensor, an imaging device and a processor. The droplet sensor has a detected area located between a droplet dispenser and a target area, wherein the droplet sensor detects a droplet output from the droplet dispenser, and outputs a corresponding droplet detection signal. The imaging device captures an image of the target area. The processor obtains a dripping time point at which the droplet passes through the detected area according to the droplet detection signal, and determines whether the target area is shielded within a first time range according to the image, so as to evaluate whether the droplet has successfully dropped into the target area. The above-mentioned auxiliary operating device of the droplet dispenser can objectively determine whether the droplets successfully drops into the target area, and improve the accuracy of judgment.

Abstract: The application discloses a method for connecting to a network access device, a terminal and a computer-readable storage medium. The method includes: transmitting an association request message or a reassociation request message to the network access device; receiving an association response message or a reassociation response message sent by the network access device, wherein the association response message or the reassociation response message includes parameters of AP-EHT Capabilities, EHT Operation, TWT Responder Support and TWT Required, and wherein the AP-EHT Capabilities includes a field of AP-ML Support and the EHT Operation includes a field of AP-Primary Link; reading contents of the association response message or the reassociation response message, and performing a multi-link operation on the basis of the contents.

Abstract: Provided are a method and apparatus for sending a channel state, a method and apparatus for receiving a channel state and a storage medium. The method for sending a channel state includes following steps: a channel state report for characterizing a channel state comprising a precoding matrix is determined; and the channel state report for characterizing the channel state comprising the precoding matrix is sent, where the channel state report includes: a number of reported coefficients in coefficient matrixes for the precoding matrix and the reported coefficients in the coefficient matrixes for the precoding matrix; where the reported coefficients in the coefficient matrixes for the precoding matrix are used for indicating the precoding matrix.

Abstract: An X-ray device, including a sensor panel and a flexible scintillator structure disposed on the sensor panel, is provided. A manufacturing method of the X-ray device is also provided.

Abstract: An X ray device, including an array substrate, a scintillator layer, a first adhesion layer, a function film, and a second adhesion layer, is provided. The scintillator layer is disposed on the array substrate. The first adhesion layer is disposed between the scintillator layer and the array substrate. The function film is disposed on the array substrate. The second adhesion layer is disposed between the function film and the array substrate. The function film covers the scintillator layer.

Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.

Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.