Abstract: Disclosed is an LGA socket (10) including a socket body (30) having a number of terminals (40) embedded therein. A stiffener (50) is attached to the socket body. A load plate (60) and a load lever (70) are pivotally assembled to two ends of the stiffener. Prior to setting the socket on a PCB (20), the stiffener is engaged with the socket body. In course of setting the socket on the PCB, the stiffener is disengaged from the socket body and fastened to the PCB via a number of bolts (80).

Abstract: Disclosed is an LGA socket (10) including a socket body (30) having a number of terminals (40) embedded therein. A stiffener (50) is attached to the socket body. A load plate (60) and a load lever (70) are pivotally assembled to two ends of the stiffener. Prior to setting the socket on a PCB (20), the stiffener is engaged with the socket body. In course of setting the socket on the PCB, the stiffener is disengaged from the socket body and fastened to the PCB via a number of bolts (80).

Abstract: Disclosed is an LGA socket (10) including a socket body (30) having a number of terminals (40) embedded therein. A stiffener (50) is attached to the socket body. A load plate (60) and a load lever (70) are pivotally assembled to two ends of the stiffener. Prior to setting the socket on a PCB (20), the stiffener is engaged with the socket body. In course of setting the socket on the PCB, the stiffener is disengaged from the socket body and fastened to the PCB via a number of bolts (80).

Abstract: A socket includes a housing and a plurality of terminals received in the housing. Each terminal includes a securing portion inserted in the housing, a mating portion and a spring portion connected between the securing portion and the mating portion. When the socket interconnects with first and second electronic devices, the spring portion is resiliently deformed to provide resilient force to the mating portion and the mating portion therefore engages with the second electronic device with minimized wiping relative to the second electronic device.

Abstract: A fixing apparatus includes a retention module (30), four rivets (10), and a back plate (50). The retention module is attached on a motherboard (60), the motherboard defining four orifices (62) therein. The retention module defines four through holes (31) therein. The back plate is attached on an underside of the motherboard, for reinforcing the motherboard. The back plate defines four apertures (52) therein. Four posts (34) depend from the retention module through the orifices and the apertures. A bore (36) is defined through each post, and in axial alignment with a corresponding through hole. The rivets are inserted through the through holes and the bores such that the posts are firmly engaged with the motherboard and the back plate.