Abstract: The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system.

Abstract: A cooling device (1) for an electronic component (3), especially for a microprocessor, includes a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). The heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9). A rack may store several electronic components (3) to be cooled, wherein each electronic component to be cooled is included in a respective system such as respective server for a data-processing system.

Abstract: The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system.

Abstract: The invention relates to a cooling device (1) for an electronic component (3), especially for a microprocessor, with a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). According to the invention, the heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9).