Abstract: The present invention generally relates to a system for two-photon or multi-photon irradiating an artificial lens, preferably an intraocular lens preferably arranged within an eye of a patient and a method for locally adjusting a polarizability and/or a refractive index of an artificial lens preferably an intraocular lens preferably arranged within an eye of a patient. The method relates in particular to fabrication of optical profiles by adjusting polarizability through two- or multi-photon processes in a non-destructive manner.

Abstract: A method and a device are disclosed for digitizing an analog electrical signal, in which the signal is applied to a number of subchannels connected in parallel. In at least one embodiment, the amplitude ranges of immediately adjacent subchannels with respect to amplitude are in each case displaced overlapping one another, in which the overlapping amplitude ranges include the total amplitude range, in which a subchannel serves as reference channel, in which, on the basis of the reference channel, the digital output value of the immediately adjacent subchannel with respect to amplitude is corrected when the signal is in the overlap range of the two subchannels and the digital values differ from one another, and in which a total digital value is output by way of a digital output value, taking into consideration the displacements of the amplitude ranges with respect to one another.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: The invention relates to a system and a method for identifying automation components, particularly sensors, actuators and wiring components. According to the invention, each component (sensor, actuator, cable, compensation box, etc.) that is to be identified is equipped with an identification unit in which a code for identifying the automation component is stored and which outputs said identification code when being activated. Preferably, the identification unit comprises an electronic circuit (e.g. an RFID chip or a discreet circuit) while being provided with galvanically insulating (inductive, capacitive, radio-based) or galvanically conducting coupling to the component that is to be identified. The identification unit can be subsequently mounted on a component or can be inseparably connected thereto already during the production of the component.

Abstract: An automation system and a method for identifying and correcting connection errors of field devices that are connected to an automation system are provided. A connecting unit is used to optionally connect field device connections of an automation system with connections of a feed or measuring component of the automation system.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Abstract: Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Abstract: An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.