Patents by Inventor Harald Orschel

Harald Orschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for electroless copper deposition on laser-direct structured substrates
    Patent number: 9538665
    Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: January 3, 2017
    Inventors: Edwin W. Bastenbeck, Harald Orschel, Ulrich Prinz
  • AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOSITION ON LASER-DIRECT STRUCTURED SUBSTRATES
    Publication number: 20140255600
    Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
    Type: Application
    Filed: October 10, 2012
    Publication date: September 11, 2014
    Applicant: ENTHONE INC.
    Inventors: Edwin W. Bastenbeck, Harald Orschel, Ulrich Prinz