Abstract: A machine for covering a substrate (FIG. 14, 540) by means of both cathodic arc plasma deposition (CAPD) (FIG. 2) and magnetron sputtering (FIG. 1) without breaking vacuum in a single chamber (FIG. 14, 421). A computer system monitors (FIG. 3, 403, 405) and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table (FIG. 14, 470) used in conjunction with internal and external targets coats both sides of the substrate simultaneously.

Abstract: A method of forming a layered structure for adhering gold to a substrate is disclosed. The layered structure includes a first layer overlying the substrate. The first layer includes a member selected from the group consisting of metal nitrides, metal carbides and metal carbonitrides wherein the metal is selected from the group consisting of titanium, zirconium and hafnium. The layered structure also includes a transparent layer of refractory metal which overlies the first layer and underlies the gold or alloy thereof. The disclosed method includes forming the aforementioned first layer over the substrate and then forming the transparent layer of refractory metal on the first layer. Both the first layer and transparent layer are preferably formed or deposited on the substrate by a cathodic arc plasma deposition process. The method also includes forming a top layer of gold or an alloy thereof on the transparent layer, which gold layer is preferably formed or deposited by a magnetron sputtering process.

Abstract: A layered structure for adhering gold to a substrate and a method of forming such on a substrate are disclosed. An article of jewelry or the like which is formed by the disclosed method and which includes the disclosed layered structure is also disclosed. The layered structure includes a first layer overlying the substrate. The first layer includes a member selected from the group consisting of metal nitrides, metal carbides and metal carbonitrides wherein the metal is selected from the group consisting of titanium, zirconium and hafnium. The layered structure also includes a transparent layer of refractory metal which overlies the first layer and underlies the gold or alloy thereof. The disclosed method includes forming the aforementioned first layer over the substrate and then forming the transparent layer of refractory metal on the first layer. Both the first layer and transparent layer are preferably formed or deposited on the substrate by a cathodic arc plasma deposition process.