Patents by Inventor Haremi Ito

Haremi Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8226400
    Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: July 24, 2012
    Assignee: NGK Insulators, Ltd.
    Inventors: Susumu Matsuoka, Seiichi Inoue, Haremi Ito, Keiji Matsumoto
  • Publication number: 20100119640
    Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.
    Type: Application
    Filed: January 14, 2010
    Publication date: May 13, 2010
    Applicant: NGK INSULATORS, LTD.
    Inventors: Susumu Matsuoka, Seiichi Inoue, Haremi Ito, Keiji Matsumoto
  • Patent number: 7670644
    Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.
    Type: Grant
    Filed: November 5, 2002
    Date of Patent: March 2, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Susumu Matsuoka, Seiichi Inoue, Haremi Ito, Keiji Matsumoto
  • Patent number: 7132124
    Abstract: In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 ?m by forming the coating layer by a substrate layer with a thickness of 10 to 100 ?m and a surface layer with a thickness of 1 to 30 ?m. Further, the substrate layer is formed by a metal layer containing no oxide. A thin-wall honeycomb structure with a wall thickness of 30 to 200 ?m can be formed, and moreover a die for molding a honeycomb structure, in which the coating layer is not damaged and thus the durability is high, and a manufacturing method thereof can be provided.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: November 7, 2006
    Assignee: NGK Insulators, Ltd.
    Inventors: Keiji Matsumoto, Haremi Ito, Shinji Murahata
  • Publication number: 20050031727
    Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.
    Type: Application
    Filed: November 5, 2002
    Publication date: February 10, 2005
    Inventors: Susumu Matsuoka, Seiichi Inoue, Haremi Ito, Keiji Matsumoto
  • Publication number: 20040076707
    Abstract: In a die for molding a honeycomb structure, in which a coating layer is formed on a die base so that slits with a particular width are provided, the slits are provided so as to have a width of 30 to 200 &mgr;m by forming the coating layer by a substrate layer with a thickness of 10 to 100 &mgr;m and a surface layer with a thickness of 1 to 30 &mgr;m. Further, the substrate layer is formed by a metal layer containing no oxide.
    Type: Application
    Filed: July 3, 2003
    Publication date: April 22, 2004
    Inventors: Keiji Matsumoto, Haremi Ito, Shinji Murahata
  • Patent number: 4861626
    Abstract: An extrusion die an be produced and reclaimed precisely, quickly and easily in an economical way, possesses a high abrasive-resistant property and a prolonged life, produces light-weight honeycomb structures having thin partition walls and provides a large reaction surface area within the honeycomb structure for the catalyst to contact with the exhaust gases, in addition to smooth passage of the exhaust gases with little pressure loss thereof, and mitigates or eliminates the drawbacks of conventional dies.
    Type: Grant
    Filed: January 6, 1988
    Date of Patent: August 29, 1989
    Assignee: NGK Insulators, Ltd.
    Inventors: Masahiro Ihara, Kazuo Suzuki, Hideya Maekawa, Haremi Ito, Kenichi Tanaka