Abstract: A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die (2) on top of a first die (1), heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound (PR), using lithography, from a top surface of the first die (1) to a top surface of the second die (2), heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die (1) top surface and the second die (2) top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die (1) top surface and the second die (2) top surface.

Abstract: A completely digital optical receiver is provided. The optical receiver includes a photodiode configured to provide a photodiode output responsive to an on-off keyed (OOK) optical input. Two or more digital inverters connected in series with each other are configured to receive the photodiode output and provide an amplified digital output. A digital clock and data recovery (CDR) circuit receives the amplified digital output and provides a clock output and a data output. A digital photodiode discharging circuit is connected to the photodiode and controlled by the clock output of the CDR circuit.

Abstract: A completely digital optical receiver is provided. The optical receiver includes a photodiode configured to provide a photodiode output responsive to an on-off keyed (OOK) optical input. Two or more digital inverters connected in series with each other are configured to receive the photodiode output and provide an amplified digital output. A digital clock and data recovery (CDR) circuit receives the amplified digital output and provides a clock output and a data output. A digital photodiode discharging circuit is connected to the photodiode and controlled by the clock output of the CDR circuit.

Abstract: A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die (2) on top of a first die (1), heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound (PR), using lithography, from a top surface of the first die (1) to a top surface of the second die (2), heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die (1) top surface and the second die (2) top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die (1) top surface and the second die (2) top surface.

Abstract: A method and apparatus for monitoring an optical network being equipped with WDM equipment able to transmit a plurality of data channels at different wavelengths. From the said optical network a part of its optical signal power is coupled out and a specific statistical function of interest is determined which characterizes the said plurality of data channels. The parameters of said determined function of interest are processed in a predetermined mathematical model having a finite number of parameters and from said model information is derived on individual channels. Data representing the said information are produced.