Patents by Inventor Harold Ackler
Harold Ackler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9243558Abstract: Certain examples present an improved compressed-air energy storage system. The system can include multiple sequential stages, in which accumulators are charged with air, which influences a hydraulic fluid to influence a pump/motor, and vice versa.Type: GrantFiled: March 13, 2012Date of Patent: January 26, 2016Assignee: StorWatts, Inc.Inventors: Dean Samara-Rubio, Elizabeth Samara-Rubio, Harold Ackler, Robert Moffat
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Patent number: 8624102Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.Type: GrantFiled: August 15, 2012Date of Patent: January 7, 2014Assignee: Palo Alto Research Center IncorporatedInventors: Hing Wah Chan, Harold Ackler, Scott E. Solberg, John S. Fitch, David K. Fork, David G. Duff, Michael C. Weisberg
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Publication number: 20130240068Abstract: Certain examples present an improved compressed-air energy storage system. The system can include multiple sequential stages, in which accumulators are charged with air, which influences a hydraulic fluid to influence a pump/motor, and vice versa.Type: ApplicationFiled: March 13, 2012Publication date: September 19, 2013Inventors: Dean Samara-Rubio, Elizabeth Samara-Rubio, Harold Ackler, Robert Moffat
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Patent number: 8389851Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.Type: GrantFiled: October 21, 2010Date of Patent: March 5, 2013Assignees: Palo Alto Research Center Incorporated, SolFocus, Inc.Inventors: Hing Wah Chan, Harold Ackler, Scott E. Solberg, John S. Fitch, David K. Fork, David G. Duff, Michael C. Weisberg
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Publication number: 20120305405Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.Type: ApplicationFiled: August 15, 2012Publication date: December 6, 2012Applicants: SolFocus, Inc., Palo Alto Research Center IncorporatedInventors: Hing Wah Chan, Harold Ackler, Scott E. Solberg, John S. Fitch, David K. Fork, David G. Duff, Michael C. Weisberg
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Publication number: 20110031211Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.Type: ApplicationFiled: October 21, 2010Publication date: February 10, 2011Inventors: Hing Wah Chan, Harold Ackler, Scott E. Solberg, John S. Fitch, David K. Fork, David G. Duff, Michael C. Weisberg
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Publication number: 20090101207Abstract: The present invention is a hermetic receiver package for improving reliability of optical components within a solar concentrator system. The hermetic receiver package includes a non-imaging concentrator and a solar cell sealed within a shell structure to provide protection from environmental degradation. The non-imaging concentrator and solar cell are guarded from degradation caused by the outside environment as well as by sources within the solar concentrator system. Features are incorporated into the non-imaging concentrator and shell which allow the hermetic receiver package to be manufactured in a cost-effective manner.Type: ApplicationFiled: February 18, 2008Publication date: April 23, 2009Applicant: SolFocus, Inc.Inventors: Michael Milbourne, Harold Ackler
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Publication number: 20080186593Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.Type: ApplicationFiled: July 24, 2007Publication date: August 7, 2008Applicants: SOL FOCUS, INC., PALO ALTO RESEARCH CENTER INCORPORATEDInventors: Hing Wah Chan, Harold Ackler, Scott E. Solberg, John S. Fitch, David K. Fork, David G. Duff, Michael C. Weisberg
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Patent number: 6684499Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.Type: GrantFiled: January 7, 2002Date of Patent: February 3, 2004Assignee: Xerox CorporationInventors: Linda T. Romano, David K. Fork, Harold Ackler
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Publication number: 20030129866Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.Type: ApplicationFiled: January 7, 2002Publication date: July 10, 2003Inventors: Linda T. Romano, David K. Fork, Harold Ackler