Abstract: Devices for mapping logical addresses to physical locations on an integrated circuit die are disclosed herein. An embodiment includes a die which has a plurality of bits that are electrically accessible by way of logical addresses. A plurality of bits have intentionally induced defects that form a predetermined fault pattern.

Abstract: Methods and devices for mapping logical addresses to physical locations on an integrated circuit die are disclosed herein. An embodiment of the method includes fabricating a die, where the die has a plurality of bits that are electrically accessible by way of logical addresses. A plurality of bits have known defects that form a predetermined fault pattern at a predetermined location on the die. The bits are tested by using the logical addresses, wherein the testing yields data as to the functionality of the bits. The test results are searched for the predetermined fault pattern. The physical locations of the defective bits constituting the predetermined fault pattern are correlated with their logical addresses based on the location of the predetermined fault pattern.

Abstract: Methods and devices for mapping logical addresses to physical locations on an integrated circuit die are disclosed herein. An embodiment of the method includes fabricating a die, where the die has a plurality of bits that are electrically accessible by way of logical addresses. A plurality of bits have known defects that form a predetermined fault pattern at a predetermined location on the die. The bits are tested by using the logical addresses, wherein the testing yields data as to the functionality of the bits. The test results are searched for the predetermined fault pattern. The physical locations of the defective bits constituting the predetermined fault pattern are correlated with their logical addresses based on the location of the predetermined fault pattern.

Abstract: An offline redundancy memory test system replaces fail memory equipment, under the control of a test system CPU, with fail memory equipment under the control of a second CPU. The second CPU is dedicated to the analysis of the contents of the offline redundancy memory test system fail memory, for redundancy identification and defect pattern analysis, at the conclusion of functional testing. Therefore, in a mass production wafer level memory test system, the test system CPU is free to prepare and execute non-functional tests on the next set of devices to be tested, thereby reducing overall memory test time by the amount of fail memory equipment analysis time previously taken by the test system CPU leading to a reduction in the total number of memory test systems required to provide redundancy memory testing.