Abstract: An H-field electromagnetic heating system for fusion bonding, particularly useful in the sealing of telecommunications cables and closures, comprises a composite bonding material having a bonding matrix and susceptors, the susceptors being magnetically reactive at a frequency above 50 MHz, and an applicator for applying radiant electromagnetic energy to the composite bonding material, at a frequency above 50 MHz (preferably 75-500 MHz). The applicator may take the form of a quarter-wave resonator having an inner conductor and an outer conductor which at least partially surrounds the inner conductor, the two conductors being shorted at a common end. The material to be heated is placed between the conductors. The inner conductor may include a resonator tube which is capacitively coupled to the power supply by a capacitive probe connected to the center conductor of a coaxial connector.