Abstract: A device for grounding static electricity from a person comprising a case and connected band to be worn on the limb of the person. The device includes an electrically conductive inner surface and an electrically insulative outer surface. A releasably securable connector is provided between a ground connection and the conductive inner surface of the device. A resistor is connected between the connector and the inner surface of the device and is located within the case.

Abstract: A solder evacuation system for removing molten solder from multiple holes in a printed circuit board. The system comprises a hollow cup assembly adapted to contact the printed circuit board. The cup assembly includes a resilient mouth adapted to contact the circuit board and encircle the molten solder area. Conduit means are connected to the cup assembly and in communication with the interior thereof. A vacuum source is connected to the conduit means and is operative for instantaneously generating a vacuum. The vacuum source comprises a hollow cylinder having a piston therein and a port to which the conduit is connected. The piston is connected to spring means which are operative when enabled to instantaneously pull the piston down the cylinder to create the vacuum. Quick-acting latch means are provided coupled to the piston to enable the piston to be withdrawn by the spring instantaneously in response to the unlatching of the latch means.

Abstract: A hand tool for extracting integrated circuit packs from printed circuit boards to which the pins of the pack have been soldered. The tool includes a pair of pivotable arms each of which carries an electrically heated tip. Each tip includes an inside face extending at a very slight angle to a plane bisecting the space between the faces and terminates in a bottom edge. The tool is arranged such that when the arms are moved toward each other the bottom edge of each tip clampingly engages and abuts the pins of a respective side of the pack at portions immediately adjacent to the printed circuit board solder joints but with the remaining inside surface of each tip remote from the remaining portions of the pins above the solder joints so that heat is applied to the pins at the joints but not appreciably to the circuit pack to effect the melting of the solder at the joints. Once the solder has melted the pack can be readily removed from the board.