Abstract: The present invention provides an ozone processing monitor and a method of using the same in ozone processing to determine whether sufficient ozone treatment has occurred on a production part needing ozone treatment. The ozone processing monitor of the present invention comprises an ozone sensitive material which is capable of thinning, bleaching, forming an oxide layer or undergoing any other physical or chemical change upon exposure to ozone, wherein said physical or chemical change produces a visible color change of said ozone sensitive material which can be monitored during or following ozone processing. The color change of the ozone sensitive material can be compared to standards to determine if too little, too much or appropriate ozone treatment has occurred.

Abstract: Disclosed is the use of a removable passivating layer in multichip packaging and CUBE applications. The process takes advantage of the fact that various metal ions will react with the carboxylic acid groups of various polyimide precursors. The polyimide will cure at a first temperature and the system may be manipulated and tested. At a later point, the polyimide is subjected to a second, higher temperature in order to decompose or completely destroy the polyimide.

Abstract: There is provided, a stabilized multi-layered colored filter structure useful in a digital color camera and method for making same. The method involves effecting reaction between a polyfunctional organosilicon material, such as a hexaorganosilazane with at least one phenolic resist containing an organic dye color forming filter, in a multi-layered structure of color filters on a silicon chip.

Abstract: Disclosed is the use of a removable passivating layer in multichip packaging and CUBE applications. The process takes advantage of the fact that various metal ions will react with the carboxylic acid groups of various polyimide precursors. The polyimide will cure at a first temperature and the system may be manipulated and tested. At a later point, the polyimide is subjected to a second, higher temperature in order to decompose or completely destroy the polyimide.

Abstract: A process is disclosed for forming multilayered polyimide structure from negative photosensitive polyimide precursors. An initial polyimide layer is deposited and imagewise exposed. The unexposed portions of the initial polyimide layer are inhibited and then a second polyimide layer is deposited and likewise imagewise exposed. The films are developed, thereby forming a multilayer polyimide structure. After formation of the multilayer polyimide structure, a conductive material is applied on a substrate and then the polyimide layers are lifted off thereby forming a desired pattern of metallization.

Abstract: A temperature-sensitive film such as a resist is baked onto a semiconductor substrate such as a mask blank by immersion in a heated liquid. A barrier coating may optionally be applied to the substrate prior to immersion and later removed. The substrate is subsequently cooled by immersing the substrate in a cooling liquid or dissolving the heated liquid from the substrate with a rinsing liquid at a temperature sufficiently lower than that of the heated liquid. Temperature uniformity within .+-.0.2.degree. C. is thereby achieved across the regions of varying thickness in the silicon wafer and membrane. Where a resist has been deposited on the mask blank substrate, heating and cooling by immersion results in improved line size control after exposure and development down to 0.25 .mu.m.

Abstract: Acid sensitive polymeric compositions, and improved chemically amplified microlithographic resist compositions comprising the acid sensitive polymeric compositions, and methods for the preparation and use thereof are disclosed. The compositions comprise, in admixture, a polymeric binder, an acid labile moiety which provides selective aqueous base solubility upon cleavage, and a compound that generates acid upon exposure of the resist composition to imaging radiation. More particularly, the compositions have one or more acid labile ketal groups, which may be chemically linked to a polymeric resin or which may be incorporated into a separate component to form a dissolution inhibitor. Crosslinking of the polymer to produce a high molecular weight, nonpolar resin may also occur by ketal exchange. Upon exposure, molecular weight and polarity changes of the crosslinked resin produce high contrast during development.

Abstract: Novel intermediate compounds capable of being applied to a semiconductor precursor by spin-on methods which exhibit good planarity and gap-fill characteristics, the cured composites of which are capable of withstanding temperatures in excess of 500.degree. C. The disclosure further encompasses a process for fabricating semiconductor devices utilizing the intermediate compounds and its composite.