Abstract: A desoldering tool for removing soldered electronic components from printed circuit boards includes a plurality of electric heater bars disposed in spaced apart, opposed relationship so as to grasp the component to be removed. The heater bars are shaped to contact the solder terminations to be desoldered and are composed of an alloy of high electrical resistivity, such as Nichrome. The heater bars are each removably attached to a pair of cantilever spring plates carried by the enlarged end of the handle of the desoldering tool by a different pair of bus bars enclosed in a molded plastic housing providing support and electrical insulation. One bus bar of each pair is rigidly attached to one spring plate while the other bus bar is attached to the other spring plate so that the cantilever spring plates urge the heater bars against the solder terminations and retain the component for physical removal.