Patents by Inventor Harold Winters

Harold Winters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080121214
    Abstract: The invention relates to rapid multiple ignition, in which the maximum breakdown voltage for the spark breakdown is available a number of times during an ignition time window. The ignition system operates with a DC converter with which the voltage of the on-board vehicle electrical system is increased, and with rod-type ignition transformers whose minimized ignition coils permit rapid recharging. The ignition electronics operate with a power output stage which charges the rod-type ignition transformer by switching a power switch in the ground path of the primary winding. The output stage power switch is actuated by a time control arrangement which clocks the power switch for charging the rod-type ignition transformer and connects the primary side of the ignition transformer to ground for a prespecified time period in order to achieve the spark breakdown after charging of the ignition transformer.
    Type: Application
    Filed: November 12, 2005
    Publication date: May 29, 2008
    Applicant: DaimlerChrysler AG
    Inventors: Dietmar Bertsch, Wilfried Schmolla, Harold Winter
  • Patent number: 7148073
    Abstract: Methods and systems for preparing a substrate for analysis are provided. One method includes removing a portion of a copper structure on the substrate using an etch chemistry in combination with an electron beam. The etch chemistry is substantially inert with respect to the copper structure except in the presence of the electron beam. Other methods involve forming masking layers on a substrate that will protect the substrate during etching. For example, one method includes exposing a first portion of the substrate to an electron beam. A second portion of the substrate not exposed to the electron beam includes a copper structure. The method also includes exposing the substrate to a fluorine containing chemical. The fluorine containing chemical bonds to the first portion but not the second portion to form a fluorine containing layer on the first portion.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: December 12, 2006
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: David Soltz, Mehran Nasser-Ghodsi, Harold Winters, John W. Coburn, Alexander Gubbens, Gabor Toth