Patents by Inventor Harpuneet Singh
Harpuneet Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9419032Abstract: A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies.Type: GrantFiled: August 14, 2009Date of Patent: August 16, 2016Assignee: NANCHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTDInventors: Harpuneet Singh, Dongkai Shangguan, Samuel Waising Tam
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Patent number: 9118825Abstract: A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.Type: GrantFiled: February 10, 2009Date of Patent: August 25, 2015Assignee: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTD.Inventors: Harpuneet Singh, Irmina Carpio, Guan Hock Yeow
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Patent number: 9029759Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.Type: GrantFiled: April 12, 2012Date of Patent: May 12, 2015Assignee: Nan Chang O-Film Optoelectronics Technology LtdInventors: Harpuneet Singh, Giles Humpston, Ellis Chau, Eddie Azuma, Peter Pietrangelo, Ocie Ward
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Publication number: 20150026971Abstract: A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.Type: ApplicationFiled: May 19, 2014Publication date: January 29, 2015Applicant: DigitalOptics CorporationInventor: Harpuneet Singh
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Patent number: 8730369Abstract: A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.Type: GrantFiled: June 4, 2013Date of Patent: May 20, 2014Assignee: DigitalOptics CorporationInventor: Harpuneet Singh
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Publication number: 20140098288Abstract: A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process.Type: ApplicationFiled: December 10, 2013Publication date: April 10, 2014Applicant: DigitalOptics CorporationInventor: Harpuneet Singh
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Patent number: 8605208Abstract: A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process.Type: GrantFiled: April 24, 2008Date of Patent: December 10, 2013Assignee: DigitalOptics CorporationInventor: Harpuneet Singh
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Publication number: 20130270419Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.Type: ApplicationFiled: April 12, 2012Publication date: October 17, 2013Applicant: DIGITALOPTICS CORPORATIONInventors: Harpuneet Singh, Giles Humpston, Ellis Chau, Eddie Azuma, Peter Pietrangelo, Ocie Ward
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Publication number: 20130265481Abstract: A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.Type: ApplicationFiled: June 4, 2013Publication date: October 10, 2013Inventor: Harpuneet Singh
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Patent number: 8456560Abstract: A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.Type: GrantFiled: January 26, 2007Date of Patent: June 4, 2013Assignee: DigitalOptics CorporationInventor: Harpuneet Singh
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Publication number: 20130128106Abstract: A camera module including a flexible tape substrate (e.g., a flexible printed circuit tape portion) having a plurality of surface mount components and a first frame member mounted to a first side of the substrate and an image sensor and a frame member mounted to an opposing second side of the substrate. The substrate includes a body portion and one or more leads or wing members having conductive contacts thereon extending from the body portion. The wing members may be folded onto the second frame member so that the conductive contacts of the wing members generally face in a different direction than conductive contacts of the body portion to provide an electrical path to the surface mount components in a manner that is free of using vias extending through the substrate. A tubular housing and lens barrel may be mounted to the substrate over the first frame member.Type: ApplicationFiled: November 23, 2011Publication date: May 23, 2013Applicant: Flextronics AP, LLCInventors: Samuel Tam, Harpuneet Singh
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Patent number: 8093092Abstract: A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed.Type: GrantFiled: July 14, 2009Date of Patent: January 10, 2012Assignee: Flextronics AP, LLCInventors: Harpuneet Singh, Liqun Larry Wang, Tic Medina
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Publication number: 20110037886Abstract: A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies.Type: ApplicationFiled: August 14, 2009Publication date: February 17, 2011Inventors: Harpuneet Singh, Dongkai Shangguan, Samuel Waising Tam
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Patent number: 7714931Abstract: A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).Type: GrantFiled: June 25, 2004Date of Patent: May 11, 2010Assignee: Flextronics International USA, Inc.Inventors: Harpuneet Singh, Nicholas E. Brathwaite, Bhret R. Graydon
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Publication number: 20100105160Abstract: A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed.Type: ApplicationFiled: July 14, 2009Publication date: April 29, 2010Inventors: Harpuneet Singh, Liqun Larry Wang, Tic Medina
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Publication number: 20100053423Abstract: A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process.Type: ApplicationFiled: April 24, 2008Publication date: March 4, 2010Inventor: Harpuneet Singh
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Publication number: 20090213262Abstract: A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.Type: ApplicationFiled: February 10, 2009Publication date: August 27, 2009Applicant: FLEXTRONICS AP, LLCInventors: Harpuneet Singh, Irmina Carpio, Guan Hock Yeow
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Publication number: 20090015706Abstract: A disclosed example camera module includes a substrate, an integrated circuit image capture device (ICD) mounted on the substrate, the image capture device having an array of light sensors on its top surface, a first lens unit rigidly fixed to the top surface of the image capture device, a second lens unit, and a lens actuator mounted on the substrate. The lens actuator adjustably supports the second lens unit over the first lens unit. The first lens unit includes a stacked plurality of lenses. Optionally, the second lens unit also includes a stacked plurality of lenses. Movement of the second lens unit with respect to the first lens unit provides a focus and/or zoom function.Type: ApplicationFiled: April 24, 2008Publication date: January 15, 2009Inventor: Harpuneet Singh
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Publication number: 20080180566Abstract: A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.Type: ApplicationFiled: January 26, 2007Publication date: July 31, 2008Inventor: Harpuneet Singh
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Publication number: 20050285973Abstract: A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).Type: ApplicationFiled: June 25, 2004Publication date: December 29, 2005Inventors: Harpuneet Singh, Nicholas Brathwaite, Bhret Graydon