Abstract: The density for any generation of Standard In-Line Memory Module (SIMM), or Dual In-Line-Memory Module (DIMM), chipset used to provide computer Random Access Memory (RAM), can be multiplied by surface-mounting multiple banks of SIMMs or DIMMs, where each bank occupies one side of a printed-circuit board (PCB) and at least a second PCB is connected to a first PCB, which is in turn connected through the standard edge connectors to the bus, with the banks connected through shared and controlled input-and-output lines, and wherein a single standard controller directs address-oriented storage to the corresponding portion of the stacked and connected banks.