Patents by Inventor Harry Fu

Harry Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Publication number: 20240096753
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes: a substrate having a device area and a peripheral area surrounding the device area; a via, disposed at the peripheral area and extending at least partially through the substrate; an insulating structure, disposed at the peripheral area, extending at least partially through the substrate and surrounding the via; and a doped region, disposed at the peripheral area, over or in the substrate and adjacent to the via.
    Type: Application
    Filed: January 18, 2023
    Publication date: March 21, 2024
    Inventors: Harry-Haklay Chuang, Shiang-Hung Huang, Hsin Fu Lin
  • Patent number: 11935918
    Abstract: An integrated circuit (IC) device comprises a high voltage semiconductor device (HVSD) on a frontside of a semiconductor body and further comprises an electrode on a backside of the semiconductor body opposite the frontside. The HVSD may, for example, be a transistor or some other suitable type of semiconductor device. The electrode has one or more gaps directly beneath the HVSD. The one or more gaps enhance the effectiveness of the electrode for improving the breakdown voltage of the HVSD.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Harry-Hak-Lay Chuang, Hsin Fu Lin, Tsung-Hao Yeh
  • Patent number: 11765998
    Abstract: A power saw for pruning high grown trees is disclosed. The power saw is configured to couple to an extension pole that allows the power saw to reach high hanging targets. The power saw includes a housing having a wireless receiver and a motor subassembly contained therein. A housing battery is electrically coupled to the wireless receiver. A front handle is coupled to the housing. The front handle comprises a faceplate and a pole aperture disposed at a terminal end. A blade is configured to extend through a blade slot of the faceplate wherein the blade is coupled to the motor subassembly. An extension pole is configured to couple to the pole aperture of the front handle. The blade is configured to move upon actuation of a wireless remote control. The wireless remote control includes a wireless transmitter and is configured to allow both hands of a user to handle the extension pole while in operation.
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: September 26, 2023
    Assignee: SANTAFE TECHNOLOGY LLC
    Inventors: Harry Fu, Ning Dong
  • Publication number: 20070263348
    Abstract: A docking station provides supporting functions for portable electronic devices, such as music players, satellite radio receivers, and video game players. The supporting functions may include providing power, an audio amplifier, speakers, and a video or audio display. The docking station includes a base portion and a connector slidably engaged with the base portion for centering the portable electronic device with respect to the base portion. The base portion includes circuitry for processing signals from the portable electronic device. The connector can be attached to a circuit board that is slidably disposed between the base portion and an attachment portion removably connected to the base portion. The docking station can recognize the type of device connected and configure itself to accommodate the requirements of the portable electronic device. The docking station can include a display portion perpendicular to the base portion.
    Type: Application
    Filed: December 19, 2006
    Publication date: November 15, 2007
    Inventors: Mark Rutledge, John Durbin, Harry Fu, David Hatcher, Michelle Lin
  • Publication number: 20050023793
    Abstract: This is a three wheel, foot-powered scooter with a steering column in front. The two front wheels are the driving wheels. Each is driven separately by a foot pedal via a speed-increase gear set. The rear wheel is the steering wheel, which is manipulated by the steering column via a mechanical linkage.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 3, 2005
    Inventor: Harry Fu