Patents by Inventor Harry R. Scholz

Harry R. Scholz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit packages
    Patent number: 4803540
    Abstract: A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.
    Type: Grant
    Filed: November 24, 1986
    Date of Patent: February 7, 1989
    Assignee: American Telephone and Telegraph Co., AT&T Bell Labs
    Inventors: Harold W. Moyer, Harry R. Scholz
  • Electronic component package using multi-level lead frames
    Patent number: 4801765
    Abstract: Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame includes a paddle for mounting the chip. The upper lead frame initially has its leads tied together and a center portion is punched out to fit the size of the particular chip. The two lead frames are preferably coplanar in the area around the boundaries of the package encapsulant.
    Type: Grant
    Filed: January 6, 1986
    Date of Patent: January 31, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Harold W. Moyer, Harry R. Scholz
  • Registration and assembly of integrated circuit packages
    Patent number: 4565314
    Abstract: The so-called blind assembly operation involving precise registration between the blind side of chip carriers or similar macro scale subassemblies and a metallized (patterned) support member requires improvements to reduce packaging costs. The proposal is to form indents aligned in both mating surfaces and place an aligning ball in the lower indent. The upper surface is positioned approximately and manipulated in x and y directions until the alignment ball recesses into both indents.
    Type: Grant
    Filed: September 9, 1983
    Date of Patent: January 21, 1986
    Assignee: AT&T Bell Laboratories
    Inventor: Harry R. Scholz
  • Semiconductor integrated circuit packages
    Patent number: RE34269
    Abstract: A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: June 1, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Harold W. Moyer, Harry R. Scholz