Abstract: An electronic device module includes: a core layer having an opening; an electronic device disposed in the opening, one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer; and an encapsulant layer at least partially embedding the core layer and the electronic device.

Abstract: A chip arrangement is provided. The chip arrangement may include a chip including a first main surface, wherein the first main surface includes an active area, a chip termination portion, and at least one contact pad. A first dielectric layer at least partially covers the chip termination portion and the active area, and at least partially exposes the at least one contact pad, and a second dielectric layer formed by atomic layer deposition over the first dielectric layer and over the at least one contact pad.

Abstract: A method of forming a layer structure is provided. The method may include plasma-treating a metal surface with a hydrogen-containing plasma, thereby forming nucleophilic groups over the metal surface, and forming an organic layer over the metal surface, wherein the organic layer comprises silane and is covalently bonded to the nucleophilic groups.

Abstract: A method for providing coated leadframes in a process line includes: feeding a plurality of leadframes successively into a process line; depositing a layer onto a main face of the leadframes; measuring physical properties of the layer by one of ellipsometry or reflectometry; assigning measured physical data to any one of a plurality of categories; and depending on a resulting category of the measured physical data, altering process parameters of the depositing, not altering the process parameters of the depositing, or shutting down the process line.

Abstract: A method of forming a layer structure is provided. The method may include plasma-treating a metal surface with a hydrogen-containing plasma, thereby forming nucleophilic groups over the metal surface, and forming an organic layer over the metal surface, wherein the organic layer comprises silane and is covalently bonded to the nucleophilic groups.

Abstract: Disclosed is a method and a respective apparatus for ultrasonic wet treatment of a plate-like article, which comprises: bringing a solid element, which is connected to a transducer in close proximity to a surface of a plate-like article so that a gap is formed between the solid element and the plate-like article, the gap having a distance d2 between 0.1 mm and 5 mm, dispensing liquid for filling the gap between the solid element and the plate-like article, and detecting ultrasonic waves and/or controlling the distance d2, by measuring the distance d2, comparing the measured distance with a desired distance d0 and adjusting the distance accordingly.

Abstract: Disclosed is a method and a respective apparatus for ultrasonic wet treatment of a plate-like article, which comprises: bringing a solid element, which is connected to a transducer in close proximity to a surface of a plate-like article so that a gap is formed between the solid element and the plate-like article, the gap having a distance d2 between 0.1 mm and 5 mm, dispensing liquid for filling the gap between the solid element and the plate-like article, and detecting ultrasonic waves and/or controlling the distance d2, by measuring the distance d2, comparing the measured distance with a desired distance d0 and adjusting the distance accordingly.

Abstract: The invention relates to a method for the treatment of disk-like objects with one first liquid and at least one second liquid at least in a defined edge region of a disk-like object.

Abstract: The invention relates to a method for the treatment of disk-like objects with one first liquid and at least one second liquid at least in a defined edge region of a disk-like object.