Patents by Inventor Harry Shimp

Harry Shimp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130309579
    Abstract: The invention includes battery electrode core plates utilizing an expanded foil processed to reduce protrusions on the strands of the expanded foil. Expanded foils may be metal or metal-coated plastic. Reducing or eliminating protrusions on the expanded foil mitigate the risk of internal shorts due to protrusion cross-over or “hot spots.” Protrusion reduction may be achieved using chemical etching via various chemical or electrochemical processes that preferentially free or remove material from burrs and free chads, in addition to removing material from sharp edges of the expanded foil.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 21, 2013
    Applicant: DEXMET CORPORATION
    Inventors: Harry Shimp, Robert Bochman, Kenneth Mull
  • Publication number: 20110167587
    Abstract: A composite bushing substrate and method of producing the same are provided. The composite bushing substrate may include a clad metal, created by metallically bonding a high strength base layer and an interlayer. The surface of the interlayer may be textured or embossed to form a surface with a high surface area. A low friction surface material may be applied to the textured interlayer surface, resulting in a composite bushing material that can resist deformation of the surface material.
    Type: Application
    Filed: February 3, 2010
    Publication date: July 14, 2011
    Inventors: Harry Shimp, Bob Bochman, Moe Rahamat
  • Publication number: 20100108342
    Abstract: An improved layered structure with an outer lightning protection surface is provided. The layered structure may include an expanded metal foil processed to reduce the number, severity, or the number and severity of stress concentration sites, thereby reducing micro-crack initiation sites. Chemical etching, mechanical micro-deburring processes, or both may be used to address stress concentration sites on the expanded metal foil.
    Type: Application
    Filed: October 31, 2008
    Publication date: May 6, 2010
    Applicant: DEXMET CORPORATION
    Inventors: Harry Shimp, Kenneth Mull