Patents by Inventor Harry Thomas Minikel

Harry Thomas Minikel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insertion of electrical component within a via of a printed circuit board
    Patent number: 7188410
    Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: March 13, 2007
    Assignee: International Business Machines Corporation
    Inventors: Timothy Wayne Crockett, Harry Thomas Minikel
  • Insertion of electrical component within a via of a printed circuit board
    Patent number: 6983535
    Abstract: A method for reducing the impedance of a reference path in a printed circuit board includes forming a printed circuit board having a plurality of conductive layers including first, second, third, and fourth layers. The printed circuit board includes two or more vias interconnecting two or more of the conductive layers. A first via is part of a signal path configured to carry a signal from the first layer to the second layer. A second via is part of a reference path configured to carry said signal from a third layer to a fourth conductive layer. The method further includes embedding an electrical component, such as a capacitor, in the second via between two of the conductive layers.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: January 10, 2006
    Assignee: International Business Machines Corporation
    Inventors: Timothy Wayne Crockett, Harry Thomas Minikel
  • Alternate port apparatus for manufacturing test of integrated serial bus and method therefor
    Patent number: 6654913
    Abstract: An apparatus and method for integrated serial bus testing in a data processing system are implemented. During testing of the data processing system, serial bus test signals are provided via a predetermined input/output (I/O) device port. Switching circuitry decouples I/O device control circuitry from the I/O port in response to a control signal having a first predetermined value. The switching circuitry additionally decouples the serial bus controller from the serial bus interface which fans out the serial data lines to serial peripheral devices. During operation of the data processing system, the switching circuitry couples the serial bus controller to the interface, couples the I/O device controller to the I/O device port, and decouples the serial interface from the I/O device port, in response to the control signal having a second predetermined value.
    Type: Grant
    Filed: February 17, 1999
    Date of Patent: November 25, 2003
    Assignee: International Business Machines Corporation
    Inventor: Harry Thomas Minikel
  • Insertion of electrical component within a via of a printed circuit board
    Patent number: 6621012
    Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: September 16, 2003
    Assignee: International Business Machines Corporation
    Inventors: Timothy Wayne Crockett, Harry Thomas Minikel
  • Insertion of electrical component within a via of a printed circuit board
    Publication number: 20020100611
    Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 1, 2002
    Applicant: International Business Machines Corporation
    Inventors: Timothy Wayne Crockett, Harry Thomas Minikel
  • Insertion of electrical component within a via of a printed circuit board
    Publication number: 20020100612
    Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.
    Type: Application
    Filed: January 22, 2002
    Publication date: August 1, 2002
    Inventors: Timothy Wayne Crockett, Harry Thomas Minikel