Patents by Inventor Hartmut Mahlkow
Hartmut Mahlkow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7479305Abstract: The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of silver in the second method step when the first metal is silver.Type: GrantFiled: September 6, 2002Date of Patent: January 20, 2009Assignee: Atotech Deutschland GmbHInventors: Hans-Jürgen Schreier, Hartmut Mahlkow
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Publication number: 20060189141Abstract: A solution for etching copper or a copper alloy for producing a copper surface having the brightest possible finish for a metallization that is to follow is described. The solution has a pH on the order of 4 or less and is free of sulfate ions. It comprises: a) at least one oxidizing agent selected from the group comprising hydrogen peroxide and peracids, b) at least one substance selected from the group comprising aromatic sulfonic acids and salts of the aromatic sulfonic acids and optionally c) at least one N-heterocyclic compound. Further a method for depositing metal onto the surface of copper or a copper alloy is described. Said method comprises the following method steps: a) contacting the surface with the solution in accordance with the invention and b) coating the surface with at least one metal. The solution and the method are especially suited in the production of electric circuit carriers, more specifically for semiconductor manufacturing.Type: ApplicationFiled: March 16, 2004Publication date: August 24, 2006Inventors: Hartmut Mahlkow, Christian Sparing
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Publication number: 20060165909Abstract: The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of silver in the second method step when the first metal is silver.Type: ApplicationFiled: September 6, 2002Publication date: July 27, 2006Inventors: Hans-Jurgen Schreier, Hartmut Mahlkow
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Publication number: 20050175780Abstract: A processing solution and a method are used for producing solderable and bondable silver layers that properties of which are not degraded even after storing, with no anti-tarnishing compounds being utilized as contrasted with prior art solutions and methods. The acidic solution for silver deposition contains silver ions and at least one Cu(I) complexing agent, said Cu(I) complexing agent being selected from the group consisting of having the structure element (I).Type: ApplicationFiled: May 27, 2003Publication date: August 11, 2005Applicant: Atotech Deutschland GmbHInventors: Christian Sparing, Hartmut Mahlkow
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Patent number: 6869637Abstract: Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ ions.Type: GrantFiled: September 21, 2001Date of Patent: March 22, 2005Assignee: Atotech Deutschland GmbHInventors: Carl Hutchinson, Hartmut Mahlkow, Christian Sparing
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Patent number: 6698648Abstract: Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit carriers provided as well as of corresponding circuit carriers.Type: GrantFiled: January 17, 2002Date of Patent: March 2, 2004Assignee: Atotech Deutschland GmbHInventors: Christian Wunderlich, Petra Backus, Hartmut Mahlkow
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Publication number: 20030157264Abstract: Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ ions.Type: ApplicationFiled: February 19, 2003Publication date: August 21, 2003Inventors: Carl Hutchinson, Hartmut Mahlkow, Christian Sparing
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Publication number: 20030052157Abstract: The inventive method provides solderable areas in addition to bondable areas on circuit carriers, wherein solderability is not impaired by exposing the circuit carriers to the effects of temperature. The inventive method comprises the following steps: solderable surfaces are produced by deposition of a solderable metal layer (5), the solder areas are covered by a mask (6), functional surfaces (7, 8) are created in the functional areas and the covering mask (6) is finally removed.Type: ApplicationFiled: January 17, 2002Publication date: March 20, 2003Inventors: Christian Wunderlich, Petra Backus, Hartmut Mahlkow
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Patent number: 6336962Abstract: The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(III) ions and additionally at least one organic compound selected from the group consisting of formic acid, aromatic carboxylic acids having the chemical formula: where R1, . . . , R4=H, alkyl, alkenyl, alkynyl, OH, and the salts, esters or amides of these compounds; b) adjusting the pH of the solution to 1 to 6 using pH adjusting agents; and c) bringing the workpiece into contact with the solution such that gold coating is plated onto the palladium surface.Type: GrantFiled: July 7, 2000Date of Patent: January 8, 2002Assignee: Atotech Deutschland GmbHInventors: Petra Backus, Hartmut Mahlkow, Christian Wunderlich
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Patent number: 5882736Abstract: A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, permanently glossy, bright palladium layer with few pores. The metal surface may be pretreated in a cementation palladium bath. The metal surface contains at least one of copper, nickel, and cobalt, as well as their alloys with one another and/or with phosphorus or boron.Type: GrantFiled: August 20, 1997Date of Patent: March 16, 1999Assignee: Atotech Deutschland GmbHInventors: Ludwig Stein, Hartmut Mahlkow, Waltraud Strache
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Patent number: 5705219Abstract: A method for coating surfaces of a non-conductor with finely particulate solid particles by substrate-induced coagulation, including the steps of: contacting the non-conductor with a first solution containing a first polar solvent and at least one coagulation initiator comprising high molecular weight material; and, subsequently contacting the non-conductor with a dispersion which contains a second polar solvent and: a) finely particulate solid particles, b) at least one surfactant for preventing the sedimentation of the solid particles, and c) a salt, essentially free of tin ions, for selectively destabilizing the dispersion.Type: GrantFiled: March 14, 1996Date of Patent: January 6, 1998Assignee: Atotech Deutschland GmbHInventors: Jurgen-Otto Besenhard, Olaf Claussen, Hans-Peter Gausmann, Heinrich Meyer, Hartmut Mahlkow
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Patent number: 4966786Abstract: A conditioning means for basis material for producing printing circuits is an alkaline solution of a halogen-free palladium salt and 2-aminopyridine.Type: GrantFiled: August 11, 1988Date of Patent: October 30, 1990Assignee: Schering AktiengesellschaftInventors: Hans-Jurgen Ehrich, Hartmut Mahlkow
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Patent number: 4929422Abstract: A process is disclosed for the adhesive metallization of synthetic materials, by means of pre-treatment of the synthetic materials and subsequent activation, as well as chemical and, if necessary, galvanic metal deposition, characterized by pre-treating the synthetic materials initially with an alkaline solution of an oxidation agent and then with a metal salt solution.Type: GrantFiled: March 14, 1988Date of Patent: May 29, 1990Assignee: Schering AktiengesellschaftInventors: Hartmut Mahlkow, Michael Romer, Gunther Rosskamp, Hubert-Matthias Seidenspinner, Ludwig Stein, Waltraud Strache
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Patent number: 4611554Abstract: A device and method for the treatment of printed circuit boards with process solutions, in which the boards being treated are continually vertically moved by a transporting conveyer above an accumulating reservoir and below spraying nozzles which apply a process solution to the side surfaces of each board. Two collecting receivers are arranged in mirror-inverted relationship at two sides of the boards being treated. The reservoir, into which the process solution drains from the receivers and the boards, is connected to the spraying nozzles by tubular conduits, provided with regulating valves, in a closed circuit, whereby the accumulated solution is fed back to the nozzles.Type: GrantFiled: January 24, 1985Date of Patent: September 16, 1986Assignee: Schering AktiengesellschaftInventors: Hartmut Mahlkow, Horst Blasing
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Patent number: 4517254Abstract: A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2-hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.Type: GrantFiled: December 13, 1982Date of Patent: May 14, 1985Assignee: Schering AktiengesellschaftInventors: Joachim Grapentin, Hartmut Mahlkow, Jurgen Skupsch
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Patent number: 4285991Abstract: A method for producing printed circuits. An epoxy resin reinforced with glass fiber is used as basis material, coated with copper, drilled and activated. In one embodiment, the circuit diagram is applied after covering the non-desired regions with a resistance, by screen or photo printing. A nickel, cobalt, or nickel-cobalt layer is deposited onto the circuit, the circuit is covered with a solder prevention lacquer, then the eyes and bore holes are covered with copper. Alternatively, after pre-treatment and activation, all areas except the soldering eyes and bore holes are covered with resist, a nickel, cobalt or nickel-cobalt layer is applied, the circuit diagram is printed using a resist, and the eyes and bore hole are treated as above.Type: GrantFiled: May 15, 1980Date of Patent: August 25, 1981Assignee: Schering AGInventors: Klaus Gedrat, Hans-Jurgen Ehrich, Hartmut Mahlkow, Joachim Wolff
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Patent number: 4262085Abstract: A process for the preparation of metal patterns on insulating carriers by photochemical means, in particular for the preparation of printed circuits, is described, in which the carrier is treated with a photo-sensitizer in the absence of wetting agents; the carrier is irradiated in a manner corresponding to the desired pattern with a radiation source; the metal seeds formed on the surface are augmented with an aqueous palladium-salt solution; a nickel layer is deposited with a nickel or nickel-cobalt bath; the metal layer is treated with an aqueous solution containing a complex-forming agent for copper-(I) ions; and a copper layer is deposited with a currentless coppering bath.Type: GrantFiled: October 26, 1979Date of Patent: April 14, 1981Assignee: Schering AktiengesellschaftInventors: Hans-Jurgen Ehrich, Hartmut Mahlkow
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Patent number: 4248632Abstract: An activating agent for application to the unactivated surface of an organic polymer to prepare the surface for chemical metallization comprises an aqueous solution of (a) a water soluble metal salt of an inorganic acid, the metal being silver, gold, or a platinum group metal, and (b) an amount of a ligand-forming organic nitrogen compound sufficient to form a water soluble coordination complex with the metal salt, the solution having a pH between 2.2 and 7, the metal concentration being between about 0.1 and about 1 gram per liter.Type: GrantFiled: February 13, 1979Date of Patent: February 3, 1981Assignee: Schering AktiengesellschaftInventors: Hans J. Ehrich, Wolfgang Clauss, Hartmut Mahlkow