Patents by Inventor Hartwig Gernoth

Hartwig Gernoth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparation of a firm bond between copper layers and aluminum oxide ceramic without use of coupling agents
    Patent number: 5308463
    Abstract: A process for preparing a firm bond between copper layers and aluminum oxide ceramic without coupling agent layers wherein the aluminum oxide ceramic is subjected to a plasma etching process in a first vacuum chamber in the presence of oxygen and immediately thereafter plated with copper by sputtering in a second vacuum chamber.
    Type: Grant
    Filed: September 11, 1992
    Date of Patent: May 3, 1994
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Bernhard Hoffmann, Hartwig Gernoth