Patents by Inventor Haruhido Furukawa

Haruhido Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide resin composition
    Patent number: 5407986
    Abstract: There is disclosed a polyamide molding composition characterized by excellent moldability, release and lubricity, said composition comprising:(A) 100 parts by weight of a polyamide resin;(B) 0.1 to 120 parts by weight of a polydiorganosiloxane that contains neither carboxyl nor amino groups; and(C) a polysiloxane selected from the group consisting of carboxyl-containing polydiorganosiloxane and amino-containing polydiorganosiloxane, the amount of said polysiloxane (C) being 0.01 to 50 parts by weight for each 100 parts by weight of said component (B).
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: April 18, 1995
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Haruhido Furukawa, Akihiko Shirahata