Patents by Inventor Haruhiko Ikeda
Haruhiko Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100233596Abstract: It is an object of the present invention to provide a photopolymerization initiator composition having high sensitivity and excellent storage properties, a photosensitive composition containing the photopolymerization initiator composition, and a thiourethane compound preferable for the photopolymerization initiator composition. The thiourethane compound of the present invention has 2 to 6 units each of which contains a moiety represented by the following formula (i) and a moiety represented by the following formula (ii). wherein R1 is a hydrogen atom or a methyl group, and R2 is —CO—, —COO— or —COOR3— (wherein R3 is an alkylene group of 2 to 6 carbon atoms).Type: ApplicationFiled: August 14, 2007Publication date: September 16, 2010Applicant: SHOWA DENKO K.K.Inventors: Haruhiko Ikeda, Hideo Miyata, Yotaro Hattori, Katsumi Murofushi
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Patent number: 7790931Abstract: A process for preparing tetrafluorobenzene carbaldehyde alkyl acetal represented by the following formula (II), comprising reducing tetrafluorocyanobenzene represented by the following formula (I) with a metal catalyst containing a platinum group metal in the presence of an alkyl alcohol represented by R—OH (R is an alkyl group of 1 to 4 carbon atoms) and an acid; (I) wherein m is 1 or 2, n is 0 or 1, and m+n is 2, (II) wherein m and n are the same as those in the formula (I), and R is an alkyl group of 1 to 4 carbon atoms.Type: GrantFiled: June 12, 2006Date of Patent: September 7, 2010Assignee: Showa Denko K.K.Inventors: Haruhiko Ikeda, Hideo Miyata, Katsutoshi Ohno, Katsuro Urakawa
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Publication number: 20100210812Abstract: It is an object of the present invention to provide a curable composition having excellent curability and capable of forming a cured film which is excellent in surface hardness, scratch resistance, flexibility, bending property, transparency and curling property, and a cured product thereof. The curable composition of the present invention is characterized by comprising (A) a urethane compound represented by the following general formula (1), (B) a thiol compound and (C) a polymerization initiator.Type: ApplicationFiled: June 26, 2008Publication date: August 19, 2010Applicant: SHOWA DENKO K.K.Inventors: Yoshifumi Urakawa, Nobuaki Ishii, Miyuki Tomita, Yotaro Hattori, Haruhiko Ikeda, Katsumi Murofushi
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Publication number: 20100145106Abstract: The present invention provides an industrially advantageous process for preparing nuclear halogenated methylbenzyl alcohol which is a useful substance as a raw material, an intermediate for manufacturing medicines, agricultural chemicals, etc. The process of the present invention for preparing nucleus-halogenated methylbenzyl alcohol represented by the following formula (II) comprises hydrogenating nucleus-halogenated benzene carbaldehyde represented by the following formula (I); wherein m is an integer of 0 to 3, and n is an integer of 1 to 4, with the proviso that m+n is an integer of 1 to 4, wherein m and n are the same as those in the formula (I).Type: ApplicationFiled: June 12, 2006Publication date: June 10, 2010Applicant: SHOWA DENKO K.K.Inventors: Haruhiko Ikeda, Hideo Miyata
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Publication number: 20100105954Abstract: A process for preparing tetrafluorobenzene carbaldehyde alkyl acetal represented by the following formula (II), comprising reducing tetrafluorocyanobenzene represented by the following formula (I) with a metal catalyst containing a platinum group metal in the presence of an alkyl alcohol represented by R—OH (R is an alkyl group of 1 to 4 carbon atoms) and an acid; (I) wherein m is 1 or 2, n is 0 or 1, and m+n is 2, (II) wherein m and n are the same as those in the formula (I), and R is an alkyl group of 1 to 4 carbon atoms.Type: ApplicationFiled: June 12, 2006Publication date: April 29, 2010Applicant: SHOWA DENKO K.K.Inventors: Haruhiko Ikeda, Hideo Miyata, Katsutoshi Ohno, Katsuro Urakawa
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Publication number: 20100029876Abstract: A polymerization accelerator includes a specific thiol compound. A curable composition of excellent thermal stability contains the polymerization accelerator. A cured product is obtained from the curable composition. The polymerization accelerator includes a thiol compound having two or more groups represented by Formula (1) below: wherein R1 is a hydrogen atom or a C1-10 alkyl group, and m is an integer of 0, 1 or 2.Type: ApplicationFiled: June 13, 2007Publication date: February 4, 2010Inventors: Hideo Miyata, Haruhiko Ikeda, Katsumi Murofushi, Yotaro Hattori, Katsuro Urakawa
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Publication number: 20100021702Abstract: Disclosed are a scratch color-developable ink comprising an electron-donating colorless or light-color dye precursor, an electron-accepting color developer and a varnish, wherein a solid particle component contained therein has an average particle diameter of 0.3 to 25 ?m, a scratch color-developable ink comprising an electron-donating colorless or light-color dye precursor, an electron-accepting color developer and a varnish, wherein an azaphthalide compound is contained as the electron-donating colorless or light-color dye precursor, and an invisible information printed sheet obtained by printing invisible information on a support with the above scratch color-developable ink.Type: ApplicationFiled: December 19, 2007Publication date: January 28, 2010Applicant: MITSUBISHI PAPER INK MFG. CO., LTD.Inventors: Hisashi Wakasugi, Fujio Takasaki, Kazuhiro Handa, Masahiro Miyauchi, Haruhiko Ikeda
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Patent number: 7608477Abstract: In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer including a second electrode pattern is press-bonded onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer. Then, the first supporting layer and the second supporting layer are separated from the first prepreg. After separation, the first prepreg is cured. A second electronic component is connected and fixed onto the back surface of the second electrode pattern with a conductive bonding material. A third supporting layer including a third electrode pattern is press-bonded onto the second electronic component-fixed surface with a second prepreg therebetween to perform transfer.Type: GrantFiled: March 26, 2004Date of Patent: October 27, 2009Assignee: Murata Manufacturing Co., Ltd.Inventor: Haruhiko Ikeda
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Publication number: 20090023831Abstract: The present invention relates to a curable composition having high adhesiveness and transparency, comprising a thiol compound containing two or more groups represented by formula (1): wherein the symbols in the formula have the meanings as described in the specification; and an urethane compound containing an ethylenically unsaturated double bond represented by formula (2): wherein the symbols in the formula have the meanings as described in the specification.Type: ApplicationFiled: January 25, 2007Publication date: January 22, 2009Inventors: Hideo Miyata, Katsuro Urakawa, Haruhiko Ikeda, Yotaro Hattori
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Publication number: 20070196928Abstract: The analytical pretreatment column of the present invention is filled with at least the inorganic type filler having a number average diameter consisting of double pore structure having both a through pore with a number average diameter of the range of 0.5 to 25 micrometers, and meso pore with number average diameter of the range of 2 to 50 nm.Type: ApplicationFiled: March 30, 2005Publication date: August 23, 2007Inventors: Kazuki Nakanishi, Akiko Shinoda, Haruhiko Ikeda, Hiroshi Uchida
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Publication number: 20060134907Abstract: In a process for producing the component-embedded substrate, a first electronic component is connected and fixed onto a first electrode pattern with a conductive bonding material, the first electrode pattern being provided on a first supporting layer. A second supporting layer including a second electrode pattern is press-bonded onto the electronic component-fixed surface of the first supporting layer with a first prepreg therebetween to perform transfer. Then, the first supporting layer and the second supporting layer are separated from the first prepreg. After separation, the first prepreg is cured. A second electronic component is connected and fixed onto the back surface of the second electrode pattern with a conductive bonding material. A third supporting layer including a third electrode pattern is press-bonded onto the second electronic component-fixed surface with a second prepreg therebetween to perform transfer.Type: ApplicationFiled: March 26, 2004Publication date: June 22, 2006Inventor: Haruhiko Ikeda
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Patent number: 6816861Abstract: Databases store therein CAD drawings which different manufacturers have. Other databases store therein equipment specifications. All the databases are connected to a user terminal via a communication line. Data stored-destination address information is inputted to designate information on the CAD drawing or the equipment specification, from a user terminal, and one of the databases is searched based on the data stored-destination address information, thereby selecting the information on the CAD drawing or the equipment specification is selected from one of the databases, corresponding to the data-stored destination address information, based on the search.Type: GrantFiled: August 30, 2001Date of Patent: November 9, 2004Assignee: Hitachi, Ltd.Inventors: Haruhiko Ikeda, Norikazu Hamaura
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Patent number: 6803116Abstract: The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.Type: GrantFiled: August 9, 2001Date of Patent: October 12, 2004Assignee: Murata Manufacturing Co., Ltd.Inventor: Haruhiko Ikeda
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Publication number: 20040064482Abstract: Databases store therein CAD drawings which different manufacturers have. Other databases store therein equipment specifications. All the databases are connected to a user terminal via a communication line. Data stored-destination address information is inputted to designate information on the CAD drawing or the equipment specification, from a user terminal, and one of the databases is searched based on the data stored-destination address information, thereby selecting the information on the CAD drawing or the equipment specification is selected from one of the databases, corresponding to the data-stored destination address information, based on the search.Type: ApplicationFiled: September 30, 2003Publication date: April 1, 2004Applicant: Hitachi, Ltd.Inventors: Haruhiko Ikeda, Norikazu Hamaura
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Patent number: 6518375Abstract: A catalyst for the production of an ethylene polymer comprising a specific trivalent alkyl chromium compound, an inorganic oxide solid and optionally an organoaluminum compound (first catalyst), a catalyst for the production of an ethylene polymer comprising the specific trivalent alkyl chromium compound, a specific tetravalent alkyl chromium compound and an inorganic oxide solid (second catalyst) and a process for producing an ethylene polymer using those catalysts. The first catalyst of the present invention does not cause deterioration with the passage of time, is stable to heat and light, has greatly improved activity and can efficiently produce an ethylene copolymer with &agr;-olefin.Type: GrantFiled: April 3, 2000Date of Patent: February 11, 2003Assignee: Japan Polyolefins Co., Ltd.Inventors: Takashi Monoi, Haruhiko Ikeda, Hidenobu Torigoe
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Publication number: 20020107846Abstract: Databases store therein CAD drawings which different manufacturers have. Other databases store therein equipment specifications. All the databases are connected to a user terminal via a communication line. Data stored-destination address information is inputted to designate information on the CAD drawing or the equipment specification, from a user terminal, and one of the databases is searched based on the data stored-destination address information, thereby selecting the information on the CAD drawing or the equipment specification is selected from one of the databases, corresponding to the data-stored destination address information, based on the search.Type: ApplicationFiled: August 30, 2001Publication date: August 8, 2002Inventors: Haruhiko Ikeda, Norikazu Hamaura
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Publication number: 20020050320Abstract: The present invention relates to a method of bonding a conductive adhesive and an electrode together, which is capable of obtaining electrical bonding between a conductive electrode and an electrode. In this method, a conductive adhesive containing a conductive filler and an organic binder is coated on an electrode having a layer formed thereon by plating a low-melting-point material, and then heated to cure the organic binder and melt the plated layer on the electrode. As a result, the conductive filler contained in the adhesive enters the plated layer to obtain strong bonding between the plated layer and the conductive filler.Type: ApplicationFiled: August 9, 2001Publication date: May 2, 2002Applicant: Murata Manufacturing Co., Ltd.Inventor: Haruhiko Ikeda
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Patent number: 6264785Abstract: The invention provides a mounting structure of an electronic part comprising an electronic part element (3) in association with a terminal electrode (5) and mounted on a substrate (7) via an adhesive (11) characterized in that a functional group having a nucleophilic substituting property is on a surface of said terminal electrode (5) and said terminal electrode (5) is bonded to said adhesive (11) by interatomic bonding. The invention also provide a method of mounting the electronic part. Bonding strength between the electronic part and the substrate is provided by not only mechanical bonding but also chemical bonding.Type: GrantFiled: May 8, 1998Date of Patent: July 24, 2001Assignee: Murata Manufacturing Co., Ltd.Inventor: Haruhiko Ikeda
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Patent number: 6111764Abstract: A power failure-free power supply apparatus capable of minimizing time required for parallel operation of a power rectifier and a power rectifier/inverter, to thereby minimize a deterioration in operational reliability. The power rectifier converts an output of an AC power supply into DC power. A power inverter converts DC power into AC one. The power rectifier/inverter carries out rectifying/inverting operation. An output of the power rectifier and an AC output of the power rectifier/inverter are fed through a change-over unit to a load. Operation of switches is controlled depending on a detection signal of a current detector for detecting a charging current of a storage battery. A control unit permits parallel operation of the power rectifier and power rectifier/inverter when a residual capacity of the storage battery is at an increased level and permits the storage battery to be charged when the residual capacity is at a reduced level.Type: GrantFiled: October 12, 1999Date of Patent: August 29, 2000Assignee: Sanyo Denki Co., Ltd.Inventors: Satoshi Atou, Haruhiko Ikeda, Hitoshi Mikami
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Patent number: 5876898Abstract: A heat sensitive recording material is provided which can be simply prevented from falsification and is excellent in contrast between fixed portion and image portion, and a recording method using it is further provided. Moreover, there is provided a heat sensitive recording material capable of carrying out multicolor recording which is excellent in contrast of the image portions, density of the image portions, and image storage stability.Type: GrantFiled: July 16, 1996Date of Patent: March 2, 1999Assignee: Mitsubishi Paper Mills LimitedInventors: Haruhiko Ikeda, Shigetoshi Hiraishi, Koji Suematsu