Patents by Inventor Haruhiko Mori
Haruhiko Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11926683Abstract: The present invention provides a thermosetting material, which contains the following components (A) to (C) and which, when measured with a rotational viscometer at a constant shear rate (JIS K7117-2:1999), exhibits a viscosity at 25° C. and 10 s?1 of 5 Pa·s or more and 200 Pa·s or less and, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity at 25° C. and a shear rate of 100 s?1 of 0.3 Pa·s or more and 50 Pa·s or less. (A): a (meth) acrylate compound in which a substituted or unsubstituted alicyclic hydrocarbon group having 6 or more carbon atoms is ester-bonded, and which, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity of 5 to 300 mPa·s as a viscosity measured at 25° C. and 10 to 100 s?1; (B): spherical silica; and (C): a black pigment.Type: GrantFiled: June 29, 2018Date of Patent: March 12, 2024Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Yutaka Obata, Haruhiko Mori
-
Patent number: 11804638Abstract: A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.Type: GrantFiled: February 8, 2021Date of Patent: October 31, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Mitsuyoshi Nishide, Takayuki Nagano, Isao Tamaki, Tomohiro Kato, Akira Baba, Haruhiko Mori
-
Publication number: 20230109891Abstract: A solid state battery that includes: a battery element including a positive electrode layer, a negative electrode layer, and a solid electrolyte layer interposed between the positive electrode layer and the negative electrode layer; a composite protective layer covering the battery element, wherein the composite protective layer includes a first protective layer and a second protective layer arranged around the battery element so as to have an overlapping region where the first protective layer and the second protective layer overlap each other; and a conducting part capable of extracting electricity from the battery element to an outside of the solid state battery, the conducting part extending from the overlapping region to the outside of the solid state battery.Type: ApplicationFiled: December 13, 2022Publication date: April 13, 2023Inventors: Haruhiko MORI, Isao TAMAKI, Hideki IMURA, Norihide FUJIMOTO
-
Patent number: 11364663Abstract: A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s?1 of 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 s?1 of 0.3 Pa·s or more and 100 Pa·s or less.Type: GrantFiled: April 24, 2020Date of Patent: June 21, 2022Assignee: IDEMITSU KOSAN CO., LTD.Inventors: Yutaka Obata, Takeshi Iwasaki, Daichi Ogawa, Haruhiko Mori
-
Patent number: 11164695Abstract: A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.Type: GrantFiled: November 10, 2017Date of Patent: November 2, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yoshihito Otsubo, Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai, Haruhiko Mori
-
THERMOSETTING COMPOSITION, METHOD FOR MANUFACTURING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT
Publication number: 20210171683Abstract: A thermosetting composition comprising the following components (A-1), (A-2), (B), and (C), and having the viscosity of 5 to 200 Pa·s at a shear rate of 10 s?1 at 25° C., and having the viscosity of 1 to 50 Pa·s at a shear rate of 100 s?1 at 25° C., as measured by JIS K7117-2: (A-1) an acrylate compound or a methacrylate compound in which a substituted or unsubstituted alicyclic hydrocarbon group including 6 or more ring carbon atoms is ester-bonded, (A-2) a compound represented by the following formula (I-1), (B) a spherical silica, (C) a white pigment.Type: ApplicationFiled: June 4, 2019Publication date: June 10, 2021Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Yutaka OBATA, Katsuki ITO, Haruhiko MORI -
Publication number: 20210167471Abstract: A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.Type: ApplicationFiled: February 8, 2021Publication date: June 3, 2021Inventors: Mitsuyoshi Nishide, Takayuki Nagano, Isao Tamaki, Tomohiro Kato, Akira Baba, Haruhiko Mori
-
Patent number: 10770205Abstract: A method for manufacturing an electronic component including a step of providing an outer electrode that includes a step of providing a sintered layer containing a sintered metal, a step of providing an insulation layer containing an electric insulation material, and a step of providing a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof. The insulation layer is directly provided on the sintered layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.Type: GrantFiled: October 10, 2017Date of Patent: September 8, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Haruhiko Mori, Hiroyuki Otsuna
-
Publication number: 20200247019Abstract: A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s?1 of 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 s?1 of 0.Type: ApplicationFiled: April 24, 2020Publication date: August 6, 2020Applicant: IDEMITSU KOSAN CO., LTD..Inventors: Yutaka OBATA, Takeshi IWASAKI, Daichi OGAWA, Haruhiko MORI
-
Patent number: 10734142Abstract: In a method for manufacturing an electronic component, a step of providing an outer electrode includes a step of providing a sintered layer including a sintered metal, a step of providing a reinforcement layer not containing Sn but including Cu or Ni, a step of providing an insulation layer, and a step of providing a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover Bich. The reinforcement layer covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.Type: GrantFiled: October 11, 2017Date of Patent: August 4, 2020Assignee: Murata Manufacturing Co., Ltd.Inventors: Haruhiko Mori, Hiroyuki Otsuna
-
Patent number: 10668650Abstract: A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s?1 of 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 s?1 of 0.3 Pa·s or more and 100 Pa·s or less.Type: GrantFiled: June 22, 2015Date of Patent: June 2, 2020Assignee: IDEMISTU KOSAN CO., LTD.Inventors: Yutaka Obata, Takeshi Iwasaki, Daichi Ogawa, Haruhiko Mori
-
Publication number: 20200157257Abstract: The present invention provides a thermosetting material, which contains the following components (A) to (C) and which, when measured with a rotational viscometer at a constant shear rate (JIS K7117-2:1999), exhibits a viscosity at 25° C. and 10 s1 of 5 Pa·s or more and 200 Pa·s or less and, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity at 25° C. and a shear rate of 100 s1 of 0.3 Pa·s or more and 50 Pa·s or less. (A): a (meth) acrylate compound in which a substituted or unsubstituted alicyclic hydrocarbon group having 6 or more carbon atoms is ester-bonded, and which, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity of 5 to 300 mPa·s as a viscosity measured at 25° C. and 10 to 100 s?1; (B): spherical silica; and (C): a black pigment.Type: ApplicationFiled: June 29, 2018Publication date: May 21, 2020Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Yutaka OBATA, Haruhiko MORI
-
Patent number: 10546691Abstract: A capacitor that includes a conductive base material with high specific surface area, a dielectric layer covering the conductive base material with high specific surface area, and an upper electrode covering the dielectric layer, in which the conductive base material with high specific surface area is formed of a metal sintered body as a whole.Type: GrantFiled: February 5, 2018Date of Patent: January 28, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Noriyuki Inoue, Takeo Arakawa, Kensuke Aoki, Hiromasa Saeki, Koichi Kanryo, Akihiro Tsuru, Haruhiko Mori
-
Publication number: 20180158610Abstract: A capacitor that includes a conductive base material with high specific surface area, a dielectric layer covering the conductive base material with high specific surface area, and an upper electrode covering the dielectric layer, in which the conductive base material with high specific surface area is formed of a metal sintered body as a whole.Type: ApplicationFiled: February 5, 2018Publication date: June 7, 2018Inventors: NORIYUKI INOUE, Takeo Arakawa, Kensuke Aoki, Hiromasa Saeki, Koichi Kanryo, Akihiro Tsuru, Haruhiko Mori
-
Publication number: 20180090263Abstract: A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.Type: ApplicationFiled: November 10, 2017Publication date: March 29, 2018Inventors: Yoshihito Otsubo, Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai, Haruhiko Mori
-
Publication number: 20180047484Abstract: In an electronic component, an outer electrode includes a sintered layer containing a sintered metal, an insulation layer containing an electric insulation material, and a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof so as to cover each of the end surfaces of the element assembly. The insulation layer is directly provided on the sintered layer at each of the end surfaces of the element assembly so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.Type: ApplicationFiled: October 10, 2017Publication date: February 15, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Haruhiko MORI, Hiroyuki OTSUNA
-
Publication number: 20180040397Abstract: In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.Type: ApplicationFiled: October 11, 2017Publication date: February 8, 2018Inventors: Haruhiko MORI, Hiroyuki OTSUNA
-
Patent number: 9818510Abstract: In an electronic component, an outer electrode includes a sintered layer containing a sintered metal, an insulation layer containing an electric insulation material, and a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof so as to cover each of the end surfaces of the element assembly. The insulation layer is directly provided on the sintered layer at each of the end surfaces of the element assembly so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.Type: GrantFiled: September 16, 2014Date of Patent: November 14, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Haruhiko Mori, Hiroyuki Otsuna
-
Patent number: 9818511Abstract: In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.Type: GrantFiled: September 16, 2014Date of Patent: November 14, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Haruhiko Mori, Hiroyuki Otsuna
-
Publication number: 20170203476Abstract: A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s?1 of 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 s?1 of 0.Type: ApplicationFiled: June 22, 2015Publication date: July 20, 2017Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Yutaka OBATA, Takeshi IWASAKI, Daichi OGAWA, Haruhiko MORI