Abstract: An ebullient cooling device having a simple structure and capable of limiting the bubbles to an appropriate volume. The ebullient cooling device for cooling a heat generating element is provided with a plurality of vertically arranged cooling channels comprising a lower channel (2), a middle channel (3) and un upper channel (4). Each cooling channel has cooling fins (12) for guiding a refrigerant to flow in a vertical direction, and a vapor discharge path (16) formed at the side of the cooling fins (12) that is opposite the side in contact with the heat generating element. Furthermore, flow path partition/vapor discharge guiding plates (18) are provided between the cooling channels so that the bubbles that have been generated are guided to the vapor discharge path (16) and prevented from moving into the subsequent cooling channel.

Abstract: A boil cooling method forms, with a surface of an object to be cooled or a surface of a heating member in close contact with the surface of the object to be cooled made to serve as a cooling surface, a main flow channel and a sub-flow channel for a cooling liquid from the side of the cooling surface in the above-described order, arranges a plurality of nozzles penetrating a partition wall separating the sub-flow channel and the main flow channel and protruding into the main flow channel in a flow channel direction of the main flow channel, causes tip end parts of individual nozzles to be in the vicinity of or in contact with the cooling surface, causes a cooling liquid to circulate to the main flow channel and the sub-flow channel, and cools the cooling surface by boiling of the cooling liquid flowing through the main flow channel, and at the same time, supplies the cooling liquid from the side of the sub-flow channel through each of the nozzles to the vicinity of the cooling surface, and cools the cooling li

Abstract: A heat removal apparatus able to remove heat with a high heat flux from a large area is provided. A heat removal apparatus 1 has a heat removal use channel 31 provided adjacent to a heat removal object HO and a liquid supply use channel 32 extending along the heat removal use channel 31 and through which a liquid state refrigerant flows. In a wall portion 36a partitioning the heat removal use channel 31 and the liquid supply use channel 32, communicating holes 38 communicating the heat removal use channel 31 and the liquid supply use channel 32 are provided at a plurality of positions. The liquid state refrigerant is supplied from the liquid supply use channel 32 to the heat removal use channel 31 via the communicating holes 38, whereby a liquid film is formed on an inner circumferential surface of the heat removal use channel 31. The liquid film evaporates by the heat from the heat removal object HO, and the evaporated refrigerant is discharged from the heat removal use channel 31.

Abstract: In the process of boil cooling, boil cooling by nucleate boiling in a temperature area wherein transition boiling may occur is enabled to a larger cooling area.