Abstract: There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays. An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.

Abstract: There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays. An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.

Abstract: There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays. An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.

Abstract: There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system. The pitch changing apparatus, which changes the pitch of DUTs, includes a plurality of shuttles which hold DUTs, a first guide rail which guides the plurality of shuttles, a second feeder which feeds the shuttles along the first guide rail at a first pitch, a third feeder which includes a plurality of pins receiving the shuttles from the second feeder and moves the pins along the first guide rail at a second pitch, and a controller which controls a feed rate of the second feeder and a receiving rate of the third feeder.

Abstract: There is provided a pitch changing apparatus which can change a pitch of DUTs when the DUTs are transferred between trays by a shuttle revolving system. The pitch changing apparatus, which changes the pitch of DUTs, includes a plurality of shuttles which hold DUTs, a first guide rail which guides the plurality of shuttles, a second feeder which feeds the shuttles along the first guide rail at a first pitch, a third feeder which includes a plurality of pins receiving the shuttles from the second feeder and moves the pins along the first guide rail at a second pitch, and a controller which controls a feed rate of the second feeder and a receiving rate of the third feeder.

Abstract: There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays. An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.

Abstract: A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.

Abstract: A holding side contact arm (317) for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera (326) of an alignment device (320), the IC to be tested is inserted to a first opening (321a) formed on an alignment movable portion (321), and a contact member (317d) of the holding side contact arm (317) is brought to contact the alignment movable portion (321). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera (326) and performing image processing. A lock-and-free means (318) provided to a first contact arm (315a1) is made to be in a non-restricted state, a movable portion driving device (322) is driven based on the alignment amount, and the holding side contact arm (317) contacting the alignment movable portion (321) is moved with respect to a root side contact arm (316), so that alignment of a position of the IC to be tested is performed.

Abstract: A device holding apparatus comprising a base plate; a hollow pad guard provided on the base plate; a pad pin inserted to the pad guard movably in an axis direction and having a through hole; a pad provided at a tip of the pad pin and having a through hole connected to the through hole of the pad pin; and a bellows pad provided on the base plate, having a through hole connected to the through hole of the pad pin and being elastic in the axis direction; for holding by suction a device by the pad by applying a negative pressure to the through hole of the bellows pad, the through hole of the pad pin and the through hole of the pad.

Abstract: A device holding apparatus comprising a base plate; a hollow pad guard provided on the base plate; a pad pin inserted to the pad guard movably in an axis direction and having a through hole; a pad provided at a tip of the pad pin and having a through hole connected to the through hole of the pad pin; and a bellows pad provided on the base plate, having a through hole connected to the through hole of the pad pin and being elastic in the axis direction; for holding by suction a device by the pad by applying a negative pressure to the through hole of the bellows pad, the through hole of the pad pin and the through hole of the pad.

Abstract: A device holding apparatus comprising a base plate; a hollow pad guard provided on the base plate; a pad pin inserted to the pad guard movably in an axis direction and having a through hole; a pad provided at a tip of the pad pin and having a through hole connected to the through hole of the pad pin; and a bellows pad provided on the base plate, having a through hole connected to the through hole of the pad pin and being elastic in the axis direction; for holding by suction a device by the pad by applying a negative pressure to the through hole of the bellows pad, the through hole of the pad pin and the through hole of the pad.

Abstract: A sorting control method of tested ICs for sorting and reloading tested ICs held on a test tray to customer trays in accordance with test results, wherein a calculating from the test results an occurrence rate of each category of tested ICs held on the test tray and starting reloading from ICs of a category having a low occurrence rate and when a second tray for holding ICs of the category is being changed, reloading of ICs of a category having a high occurrence rate is performed.

Abstract: A device holding apparatus comprising a base plate 11; a hollow pad guard 12 provided on said base plate; a pad pin 13 inserted to said pad guard movably in an axis direction and having a through hole 131; a pad 14 provided at a tip of said pad pin and having a through hole connected to the through hole 141 of the pad pin; and a bellows pad 15 provided on said base plate, having a through hole 151 connected to the through hole of said pad pin and being elastic in the axis direction; for holding by suction a device by said pad by applying a negative pressure to the through hole 151 of said bellows pad, the through hole 131 of said pad pin and the through hole 141 of said pad.

Abstract: An IC testing apparatus 1 for performing a test by applying at least a low temperature stress to ICs to be tested comprising a refrigerant cycle 210 wherein at least a compressor 211, condenser 212, expansion valve 214 and evaporator 215 are connected in this order, and a cold air applying line 220 having a blower 223 for supplying heat exchanged cold air by the evaporator 215 to the ICs to be tested.