Abstract: A semiconductor wafer is manufactured in such a way that a main surface of a semiconductor substrate is partitioned into a plurality of semiconductor element forming regions defined by scribing regions, wherein at least one pattern for measuring a width of a cut region and its positional shift is formed in proximity to a peripheral portion of the semiconductor substrate on a scribing line. The pattern is constituted by a plurality of micro patterns that are aligned in a reverse V-shape to traverse the scribing line and a pair of elongated patterns that partially overlap seal rings formed in both sides of the scribing line. It is possible to form a channel whose width is larger than the width of the cut region on the backside of the semiconductor substrate in correspondence with the scribing region in order to avoid the formation of chipping, cracks, and burrs during cutting.

Abstract: A semiconductor substrate is partitioned along scribing lines so as to form a plurality of IC regions encompassed by seal rings, wherein a passivation opening is formed in the scribing line in which a monitoring element is formed within a monitoring element region, which is encompassed by secondary seal rings, which are constituted by metal layers, oxidation layers and via holes. The secondary seal rings are formed to encompass the periphery of the monitoring element, which can thus precisely monitor characteristics of integrated circuits because it is possible to prevent water and impurities from infiltrating into the monitoring element region which is thus stabilized in characteristics.

Abstract: A semiconductor wafer is manufactured in such a way that a main surface of a semiconductor substrate is partitioned into a plurality of semiconductor element forming regions defined by scribing regions, wherein at least one pattern for measuring a width of a cut region and its positional shift is formed in proximity to a peripheral portion of the semiconductor substrate on a scribing line. The pattern is constituted by a plurality of micro patterns that are aligned in a reverse V-shape to traverse the scribing line and a pair of elongated patterns that partially overlap seal rings formed in both sides of the scribing line. It is possible to form a channel whose width is larger than the width of the cut region on the backside of the semiconductor substrate in correspondence with the scribing region in order to avoid the formation of chipping, cracks, and burrs during cutting.

Abstract: In a semiconductor device comprising a MOS transistor driven at a relatively low voltage and a MOS transistor driven at a relatively high voltage formed on the same semiconductor substrate, the MOS transistor driven at the relatively high voltage comprises: a first active region of a first conductivity type in the semiconductor substrate; a first gate oxide film formed on the first active region and having increased thickness at the edge regions thereof than in the central region thereof in the direction of current flow; and a first electrode formed on the first gate oxide film and doped at a relatively low concentration with an impurity of a second conductivity type which is opposite to the first conductivity type; and the MOS transistor driven at the relatively low voltage comprises: a second active region of a first conductivity type in the semiconductor substrate; a second gate oxide film formed on the second active region; and a second electrode formed on the second gate oxide film and doped at a relativ

Abstract: A semiconductor substrate is partitioned along scribing lines so as to form a plurality of IC regions encompassed by seal rings, wherein a passivation opening is formed in the scribing line in which a monitoring element is formed within a monitoring element region, which is encompassed by secondary seal rings, which are constituted by metal layers, oxidation layers and via holes. The secondary seal rings are formed to encompass the periphery of the monitoring element, which can thus Precisely monitor characteristics of integrated circuits because it is Possible to prevent water and impurities from infiltrating into the monitoring element region which is thus stabilized in characteristics.

Abstract: In a semiconductor device comprising a MOS transistor driven at a relatively low voltage and a MOS transistor driven at a relatively high voltage formed on the same semiconductor substrate, the MOS transistor driven at the relatively high voltage comprises: a first active region of a first conductivity type in the semiconductor substrate; a first gate oxide film formed on the first active region and having increased thickness at the edge regions thereof than in the central region thereof in the direction of current flow; and a first electrode formed on the first gate oxide film and doped at a relatively low concentration with an impurity of a second conductivity type which is opposite to the first conductivity type; and the MOS transistor driven at the relatively low voltage comprises: a second active region of a first conductivity type in the semiconductor substrate; a second gate oxide film formed on the second active region; and a second electrode formed on the second gate oxide film and doped at a relativ

Abstract: In a semiconductor device comprising a MOS transistor driven at a relatively low voltage and a MOS transistor driven at a relatively high voltage formed on the same semiconductor substrate, the MOS transistor driven at the relatively high voltage comprises: a first active region of a first conductivity type in the semiconductor substrate; a first gate oxide film formed on the first active region and having increased thickness at the edge regions thereof than in the central region thereof in the direction of current flow; and a first electrode formed on the first gate oxide film and doped at a relatively low concentration with an impurity of a second conductivity type which is opposite to the first conductivity type; and the MOS transistor driven at the relatively low voltage comprises: a second active region of a first conductivity type in the semiconductor substrate; a second gate oxide film formed on the second active region; and a second electrode formed on the second gate oxide film and doped at a relativ