Patents by Inventor Harunari Hasegawa
Harunari Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11114318Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.Type: GrantFiled: April 25, 2019Date of Patent: September 7, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Hisashi Inoue, Masahiro Kobayashi, Michihiro Takahashi, Tamotsu Hatakeyama, Harunari Hasegawa, Hiroshi Kikuchi, Yoshihisa Kumagai
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Patent number: 10518986Abstract: A method for conveying a reaction tube unit including a vertical reaction tube and a gas supply pipe provided at a distance from an inner wall of the vertical reaction tube along a longitudinal direction thereof, the method includes: arranging a buffer inside the reaction tube between the inner wall and the gas supply pipe to alleviate a collision; placing the reaction tube unit attached with the buffer on a carriage via a vibration isolator; and conveying the reaction tube unit by moving the carriage.Type: GrantFiled: May 6, 2019Date of Patent: December 31, 2019Assignee: Tokyo Electron LimitedInventors: Masahiro Kobayashi, Tamotsu Hatakeyama, Harunari Hasegawa, Michihiro Takahashi, Daisuke Yamanaka
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Publication number: 20190344981Abstract: A method for conveying a reaction tube unit including a vertical reaction tube and a gas supply pipe provided at a distance from an inner wall of the vertical reaction tube along a longitudinal direction thereof, the method includes: arranging a buffer inside the reaction tube between the inner wall and the gas supply pipe to alleviate a collision; placing the reaction tube unit attached with the buffer on a carriage via a vibration isolator; and conveying the reaction tube unit by moving the carriage.Type: ApplicationFiled: May 6, 2019Publication date: November 14, 2019Inventors: Masahiro Kobayashi, Tamotsu Hatakeyama, Harunari Hasegawa, Michihiro Takahashi, Daisuke Yamanaka
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Publication number: 20190333789Abstract: Provided is an assembling apparatus for a semiconductor manufacturing apparatus. The assembling apparatus includes: a body; lift attached to the body and configured to move a reaction tube having an opening at a lower end portion thereof vertically, thereby allowing a gas supply pipe to be installed inside the reaction tube through the opening while the reaction tube is held by the lift; gas supply source configured to supply a gas into the reaction tube through the gas supply pipe while the reaction tube is held by the lift; and an exhaust mechanism including a pump configured to exhaust an inside of the reaction tube through the opening, thereby performing a leakage test of the reaction tube while the reaction tube is held by the lift.Type: ApplicationFiled: April 25, 2019Publication date: October 31, 2019Inventors: Hisashi Inoue, Masahiro Kobayashi, Michihiro Takahashi, Tamotsu Hatakeyama, Harunari Hasegawa, Hiroshi Kikuchi, Yoshihisa Kumagai
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Patent number: 9163311Abstract: Provided is a film forming apparatus for forming a film on a substrate maintained within a film forming container by supplying a raw material gas to the substrate. The film forming container includes a substrate maintaining unit, a supply mechanism configured to include a supply pipe with supply holes formed thereon to supply a raw material gas to the interior of the film forming container through the supply holes, an exhaust mechanism configured to include an exhaust pipe with exhaust holes formed thereon to exhaust gas from the interior of the film forming container through the exhaust holes, and a controller configured to control the substrate maintaining unit, the supply mechanism, and the exhaust mechanism. The supply holes and the exhaust holes are formed to face each other with the substrate maintained in the substrate maintaining unit interposed therebetween.Type: GrantFiled: December 21, 2011Date of Patent: October 20, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Harunari Hasegawa, Kippei Sugita, Atsushi Ando, Yoshiki Fukuhara, Makoto Takahashi
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Publication number: 20120180727Abstract: Provided is a film forming apparatus for forming a film on a substrate maintained within a film forming container by supplying a raw material gas to the substrate. The film forming container includes a substrate maintaining unit, a supply mechanism configured to include a supply pipe with supply holes formed thereon to supply a raw material gas to the interior of the film forming container through the supply holes, an exhaust mechanism configured to include an exhaust pipe with exhaust holes formed thereon to exhaust gas from the interior of the film forming container through the exhaust holes, and a controller configured to control the substrate maintaining unit, the supply mechanism, and the exhaust mechanism. The supply holes and the exhaust holes are formed to face each other with the substrate maintained in the substrate maintaining unit interposed therebetween.Type: ApplicationFiled: December 21, 2011Publication date: July 19, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Harunari HASEGAWA, Kippei SUGITA, Atsushi ANDO, Yoshiki FUKUHARA, Makoto TAKAHASHI
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Publication number: 20120160169Abstract: Provided is a film forming apparatus for forming a polyimide film on a substrate by supplying a first raw material gas formed as aromatic acid dianhydride and a second raw material gas formed as aromatic diamine to the substrate maintained within a film forming container, and thermally polymerizing the supplied first and second raw material gases on a surface of the substrate. The apparatus includes: a substrate maintaining unit within the film forming container; a substrate heating unit configured to heat the substrate; a supply mechanism within the film forming container, configured to include a supply pipe with supply holes for supplying the first and second raw material gases to the interior of the film forming container through the supply holes; and a controller configured to control the substrate maintaining unit, the substrate heating unit, and the supply mechanism.Type: ApplicationFiled: December 22, 2011Publication date: June 28, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Harunari HASEGAWA, Kippei SUGITA, Makoto TAKAHASHI
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Patent number: 7072578Abstract: A carbon wire heating element sealing heater is provided. Therein, a carbon wire heating element using carbon fibers is sealed in a quartz glass member, wherein absorption water quantity of the carbon wire heating element is 2×10?3 g/cm3 or less.Type: GrantFiled: January 21, 2005Date of Patent: July 4, 2006Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Norihiko Saito, Hiroyuki Honma, Hiroshi Mori, Eiichi Toya, Tomio Konn, Tomohiro Nagata, Sunao Seko, Akira Otsu, Takanori Saito, Ken Nakao, Kazutoshi Miura, Harunari Hasegawa, George Hoshi, Katsutoshi Ishi
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Publication number: 20050133494Abstract: A carbon wire heating element sealing heater is provided. Therein, a carbon wire heating element using carbon fibers is sealed in a quartz glass member, wherein absorption water quantity of the carbon wire heating element is 2×10?3 g/cm3 or less.Type: ApplicationFiled: January 21, 2005Publication date: June 23, 2005Inventors: Norihiko Saito, Hiroyuki Honma, Hiroshi Mori, Eiichi Toya, Tomio Konn, Tomohiro Nagata, Sunao Seko, Akira Otsu, Takanori Saito, Ken Nakao, Kazutoshi Miura, Harunari Hasegawa, George Hoshi, Katsutoshi Ishi
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Patent number: 6903030Abstract: A supply system in a heat-treating apparatus for a semiconductor process has a combustor (12), heating unit (13), and gas distributor (14). The combustor (12) has a combustion chamber (59) disposed outside a process chamber (21). The combustor (12) generates water vapor by reaction of hydrogen gas and oxygen gas in the combustion chamber (59), and supplies it to the process chamber (21). The heating unit (13) has a heating chamber (61) disposed outside the process chamber (21). The heating unit (13) selectively heats a gas not passing through the combustion chamber (59) to a temperature not lower than an activating temperature of the gas, and supplies it to the process chamber (21). The gas distributor (14) selectively supplies the hydrogen gas and oxygen gas to the combustion chamber (59), and selectively supplies a reactive gas and inactive gas to the heating chamber (61).Type: GrantFiled: March 13, 2002Date of Patent: June 7, 2005Assignee: Tokyo Electron LimitedInventors: Katsutoshi Ishii, Yutaka Takahashi, Harunari Hasegawa
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Patent number: 6885814Abstract: A carbon wire heating element sealing heater is provided. Therein, a carbon wire heating element using carbon fibers is sealed in a quartz glass member, wherein absorption water quantity of the carbon wire heating element is 2×10?3 g/cm3 or less.Type: GrantFiled: March 25, 2003Date of Patent: April 26, 2005Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Takanori Saito, Hiroshi Mori, Akira Otsu, Norihiko Saito, Hiroyuki Honma, Eiichi Toya, Tomio Konn, Tomohiro Nagata, Ken Nakao, Kazutoshi Miura, Harunari Hasegawa, George Hoshi, Katsutoshi Ishi, Sunao Seko
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Publication number: 20040168638Abstract: A supply system in a heat-treating apparatus for a semiconductor process has a combustor (12), heating unit (13), and gas distributor (14). The combustor (12) has a combustion chamber (59) disposed outside a process chamber (21). The combustor (12) generates water vapor by reaction of hydrogen gas and oxygen gas in the combustion chamber (59), and supplies it to the process chamber (21). The heating unit (13) has a heating chamber (61) disposed outside the process chamber (21). The heating unit (13) selectively heats a gas not passing through the combustion chamber (59) to a temperature not lower than an activating temperature of the gas, and supplies it to the process chamber (21). The gas distributor (14) selectively supplies the hydrogen gas and oxygen gas to the combustion chamber (59), and selectively supplies a reactive gas and inactive gas to the heating chamber (61).Type: ApplicationFiled: November 10, 2003Publication date: September 2, 2004Inventors: Katsutoshi Ishii, Yutaka Takahashi, Harunari Hasegawa
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Publication number: 20030180034Abstract: A carbon wire heating element sealing heater is provided. Therein, a carbon wire heating element using carbon fibers is sealed in a quartz glass member, wherein absorption water quantity of the carbon wire heating element is 2×10−3 g/cm3 or less.Type: ApplicationFiled: March 25, 2003Publication date: September 25, 2003Applicants: TOSHIBA CERAMICS CO., LTD., TOKYO ELECTRON LIMITEDInventors: Takanori Saito, Hiroshi Mori, Akira Otsu, Norihiko Saito, Hiroyuki Honma, Eiichi Toya, Tomio Konn, Tomohiro Nagata, Ken Nakao, Kazutoshi Miura, Harunari Hasegawa, George Hoshi, Katsutoshi Ishi, Sunao Seko
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Patent number: 6516143Abstract: The fluid heating apparatus, in accordance with the present invention, developed to solve the technological problems described above is characterized by comprising at least a heating tube heating fluid to be supplied from fluid supply source, a heater section spirally formed on an outer periphery of the heating tube and a housing accommodating the heating tube and the heater section, wherein the heater section comprises a carbon wire heating element and a quartz glass tube in which the carbon wire heating element is enclosed.Type: GrantFiled: March 29, 2001Date of Patent: February 4, 2003Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Sunao Seko, Takanori Saito, Kazutoshi Miura, Harunari Hasegawa, Joji Hoshi, Katsutoshi Ishii
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Publication number: 20020023919Abstract: The fluid heating apparatus, in accordance with the present invention, developed to solve the technological problems described above is characterized by comprising at least a heating tube heating fluid to be supplied from fluid supply source, a heater section spirally formed on an outer periphery of the heating tube and a housing accommodating the heating tube and the heater section, wherein the heater section comprises a carbon wire heating element and a quartz glass tube in which the carbon wire heating element is enclosed.Type: ApplicationFiled: March 29, 2001Publication date: February 28, 2002Applicant: TOSHIBA CERAMICS CO., LTD.Inventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Sunao Seko, Takanori Saito, Kazutoshi Miura, Harunari Hasegawa, Joji Hoshi, Katsutoshi Ishii
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Patent number: D923902Type: GrantFiled: March 12, 2020Date of Patent: June 29, 2021Assignee: Tokyo Electron LimitedInventors: Masahiro Kobayashi, Michihiro Takahashi, Harunari Hasegawa, Yoshihisa Kumagai
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Patent number: D932725Type: GrantFiled: March 13, 2020Date of Patent: October 5, 2021Assignee: Tokyo Electron LimitedInventors: Masahiro Kobayashi, Michihiro Takahashi, Harunari Hasegawa, Yoshihisa Kumagai
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Patent number: D937526Type: GrantFiled: March 12, 2020Date of Patent: November 30, 2021Assignee: Tokyo Electron LimitedInventors: Masahiro Kobayashi, Michihiro Takahashi, Harunari Hasegawa, Yoshihisa Kumagai