Abstract: An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

Abstract: A resin sheet (100) is provided with a resin layer (120), and a passivation layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in a plan view. The periphery of the passivation layer (110) extends outward from the periphery of the resin layer (120). The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the outside from the flat section (121). A difference between the resin thickness (d) of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% or less of the average thickness (D).

Abstract: An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 ?m to 10 ?m, boehmite particles having an average particle diameter of 0.2 ?m to 5 ?m, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.

Abstract: An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device. These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

Abstract: A resin sheet (100) is provided with a resin layer (120), and a passivation layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in a plan view. The periphery of the passivation layer (110) extends outward from the periphery of the resin layer (120). The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the outside from the flat section (121). A difference between the resin thickness (d) of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% or less of the average thickness (D).

Abstract: In a system for restoring a controlled unit from an abnormal condition, a plurality of predicted abnormal conditions and corresponding restoring procedures are prestored. When an actually generated abnormal condition matches with one of the prestored abnormal conditions, the system restores the controlled unit from the abnormal condition based on the prestored restoring procedure corresponding to the abnormal condition which matches with the actually generated abnormal condition.