Patents by Inventor Haruo Nakayama

Haruo Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7263427
    Abstract: A failed manifold pressure sensor is identified in a control apparatus having two manifold pressure detecting systems as a failsafe. A first comparing unit outputs an abnormal signal when a difference ?P between manifold pressures PMa and PMb detected respectively by two sensors is larger than a threshold value DP. A manifold pressure estimating unit estimates the manifold pressure from the engine revolution Ne, a throttle opening PLP, and an atmospheric pressure PAa. The difference calculating unit calculates a difference ?PMb between the detected manifold pressure PMb and the estimated manifold pressure PMcal. The difference calculating unit calculates a difference ?PMa between the detected manifold pressure PMa and the estimated manifold pressure PMcal. A second comparing unit compares the difference ?PMa and the difference ?PMb in response to the aforementioned abnormal signal. The failed manifold pressure sensor is specified according to which one of the difference ?PMa and the difference ?PMb is larger.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: August 28, 2007
    Assignee: Honda Motor Co., Ltd.
    Inventors: Shumpei Hasegawa, Takashi Sasaki, Haruo Nakayama
  • Publication number: 20060184308
    Abstract: A failed manifold pressure sensor is identified in a control apparatus having two manifold pressure detecting systems as a failsafe. A first comparing unit outputs an abnormal signal when a difference ?P between manifold pressures PMa and PMb detected respectively by two sensors is larger than a threshold value DP. A manifold pressure estimating unit estimates the manifold pressure from the engine revolution Ne, a throttle opening PLP, and an atmospheric pressure PAa. The difference calculating unit calculates a difference ?PMb between the detected manifold pressure PMb and the estimated manifold pressure PMcal. The difference calculating unit calculates a difference ?PMa between the detected manifold pressure PMa and the estimated manifold pressure PMcal. A second comparing unit compares the difference ?PMa and the difference ?PMb in response to the aforementioned abnormal signal. The failed manifold pressure sensor is specified according to which one of the difference ?PMa and the difference ?PMb is larger.
    Type: Application
    Filed: February 13, 2006
    Publication date: August 17, 2006
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Shumpei Hasegawa, Takashi Sasaki, Haruo Nakayama
  • Patent number: 5807454
    Abstract: A leading edge structure for an aircraft has an outer wall, an inner wall disposed within the outer wall and including a partition with, the outer wall, the inner wall and the partition jointly defining a hot-air chamber, and a plurality of flow-rectifying fins or disposed in the hot-air chamber and compartmentalizing the hot-air chamber into a plurality of hot-air passages. The outer wall and the flow-rectifying fins are made of a fiber-reinforced synthetic resin and joined to each other by curing. The inner wall and the partition comprise a single component which is made of a fiber-reinforced synthetic resin, and being bonded to the outer wall. Alternatively, the inner wall and the partition are separate from each other and are joined to each other.
    Type: Grant
    Filed: September 4, 1996
    Date of Patent: September 15, 1998
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Shun Kawabe, Keiichi Sato, Daiya Yamashita, Haruo Nakayama, Koji Shiraishi, Keizo Matsumoto
  • Patent number: 5565697
    Abstract: A semiconductor substrate comprises a foundation, a semiconductor monocrystalline film formed on the foundation, and a high-melting-point metal film or a high-melting-point metal alloy film disposed in at least part of a region between the semiconductor monocrystalline film and the foundation. The high-melting-point metal film disposed below the semiconductor monocrystalline film can be utilized as a conductor in a semiconductor device.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: October 15, 1996
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshifumi Asakawa, Daisuke Kosaka, Haruo Nakayama
  • Patent number: 5459346
    Abstract: A semiconductor substrate comprises a foundation, a semiconductor monocrystalline film formed on the foundation, and a high-melting-point metal film or a high-melting-point metal alloy film disposed in at least part of a region between the semiconductor monocrystalline film and the foundation. The high-melting-point metal film disposed below the semiconductor monocrystalline film can be utilized as a conductor in a semiconductor device.
    Type: Grant
    Filed: November 17, 1994
    Date of Patent: October 17, 1995
    Assignee: Ricoh Co., Ltd.
    Inventors: Toshifumi Asakawa, Daisuke Kosaka, Haruo Nakayama
  • Patent number: 5197016
    Abstract: A computer-aided system and method is disclosed for designing an application specific integrated circuit (ASIC) whose intended function is implemented both by a hardware subsystem including hardware elements on the integrated circuit and by a software subsystem including a general purpose microprocessor also on the integrated circuit. The system also generates software instructions for use by the software subsystem. The system utilizes a knowledge based expert system, with a knowledge base extracted from expert ASIC designers, and thus makes it possible for ASIC's to be designed and provided quickly and economically by persons not having the highly specialized skill of an ASIC designer.
    Type: Grant
    Filed: July 14, 1989
    Date of Patent: March 23, 1993
    Assignees: International Chip Corporation, Ricoh Company, Ltd.
    Inventors: Tai Sugimoto, Hideaki Kobayashi, Masahiro Shindo, Haruo Nakayama
  • Patent number: 5173446
    Abstract: A semiconductor substrate comprises a foundation, a semiconductor monocrystalline film formed on the foundation, and a high-melting-point metal film or a high-melting-point metal alloy film disposed in at least part of a region between the semiconductor monocrystalline film and the foundation. The high-melting-point metal film disposed below the semiconductor monocrystalline film can be utilized as a conductor in a semiconductor device.
    Type: Grant
    Filed: June 13, 1991
    Date of Patent: December 22, 1992
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshifumi Asakawa, Daisuke Kosaka, Haruo Nakayama
  • Patent number: 5008554
    Abstract: An optical signal processing apparatus includes a plurality of plates disposed in parallel at spatial intervals and light LSIs mounted on each of the plates. The transfer of signals in the direction parallel to the surfaces of the plates is performed by lead wires electrically interconnecting the light LSIs. The transfer of signals in the direction normal to the surfaces is performed by the light emitted and received by the light LSIs.
    Type: Grant
    Filed: June 29, 1989
    Date of Patent: April 16, 1991
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshifumi Asakawa, Haruo Nakayama
  • Patent number: 4825113
    Abstract: A single transmission line bidirectional optical communication system comprising a directional coupler employing a polarizing beam splitter, an optical transmitting circuit for coding the data and converting the coded data into optical signals and outputting said signals, an optical receiving circuit employing a comparator having a function of automatically establishing a threshold for converting optical input signals into electrical signals and then decoding the data, a circuit for detecting the frequency differences between the sending signals and receiving signals, and a line diagnosing circuit.The polarizing beam splitter eliminates a near-end reflected beam, and the optical receiving circuit having a function of automatically establishing a threshold eliminates a remote-end reflected beam. The line diagnosing circuit diagnoses the line condition by comparing the sending frequency and receiving frequency.
    Type: Grant
    Filed: February 9, 1987
    Date of Patent: April 25, 1989
    Assignee: Seiko Instruments Inc.
    Inventors: Hirochika Sato, Haruo Nakayama, Takeshi Uchiyama, Yoshihisa Hagami, Yoshiro Sato