Patents by Inventor Hasler R. Hayes

Hasler R. Hayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance orthogonal interconnect architecture without midplane
    Patent number: 6462957
    Abstract: An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: October 8, 2002
    Assignee: Nortel Networks Limited
    Inventors: Herman Kwong, Bao Chau L. Nguyen, Van C. Au, Paul A. Senyshyn, Martin R. Handforth, Rolf G. Meier, Delfin Y. Montuno, Ernst A. Munter, Hasler R. Hayes
  • Circuit packs and circuit pack and shelf assemblies
    Patent number: 5777846
    Abstract: Circuit pack wherein the electronic components are arranged with high temperature operating components on one side of a PCB and low temperature components on the other side. The PCB acts as a thermal insulator to restrict heat flow from the hot to cooler components. The components on each side of the board are disposed in a vertical connection chimney for heat removal.
    Type: Grant
    Filed: May 30, 1996
    Date of Patent: July 7, 1998
    Assignee: Northern Telecom Limited
    Inventors: Hasler R. Hayes, Michael H. Daniels, John C. Atkinson
  • Electronic unit
    Patent number: 5276584
    Abstract: Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The units are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each unit, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: January 4, 1994
    Assignee: Northern Telecom Limited
    Inventors: Hugh M. Collins, Hasler R. Hayes, John S. Moss, Clifford D. Read, Tristano F. Nicoletta, John B. Drayton, David J. Pell, Roman Katchmar
  • Electronic module
    Patent number: 5218516
    Abstract: Electronic module of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The modules are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each module, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.
    Type: Grant
    Filed: October 31, 1991
    Date of Patent: June 8, 1993
    Assignee: Northern Telecom Limited
    Inventors: Hugh M. Collins, Hasler R. Hayes, John S. Moss, Clifford D. Read, Tristano F. Nicoletta, John B. Drayton, David J. Pell, Roman Katchmar