Abstract: An information handling system includes a processor that runs a maximum memory stress test of a memory module with a refresh rate of memory devices set to a first refresh rate. Then, the processor may receive a power consumption of the memory module. Also, the processor may receive the temperature of the memory devices, and may set the refresh rate to a second refresh rate. The processor may continuously receive both the power consumption of the memory module and the temperature of the memory devices. Based on the continuously received temperature, the processor may determine whether the temperature of the memory devices exceeds a second threshold temperature. If so, the processor may store a first setting as a refresh setting for the memory module. Otherwise, the processor may store a second setting as the refresh setting for the memory module.

Abstract: Apparatuses for expansion device retention. Specifically, the disclosed apparatuses implement retention mechanisms capable of being temporarily fastened to expansion slots whereat expansion devices may be installed. By fastening to the expansion slots, any permanent redesign and/or modification to the printed circuit boards, whereon the expansion slots may be mounted, may be minimized (if not eliminated). Amongst the disclosed apparatuses, an attachable hockey stick is introduced for expansion devices lacking a hockey stick shaped feature, where the attachable hockey stick engages with the aforementioned retention mechanisms to secure the expansion devices during, for example, shock events.

Abstract: A closed-loop control system may include an integrator configured to, based on an error between a setpoint temperature and a measured temperature, determine an integrated error indicative of a time-based integral of the error, a proportional-integral controller configured to, based on the integrated error and the error, generate a proportional-integral output driving signal, and control logic configured to control power consumption of a component based on the proportional-integral output driving signal.

Abstract: An information handling system may include an information handling resource, an air mover configured to drive air to cool the information handling resource, and a thermal control system for controlling the air mover and configured to determine an air speed requirement for the air mover and regulate an air speed of the air mover to optimize an airflow-versus-power efficiency of the air mover while satisfying the air speed requirement.

Abstract: A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.

Abstract: A communication module may be used in an information handling system comprising an air mover configured to drive a flow of air and a processing component communicatively coupled to the air mover for controlling operation of the air mover via a first wire configured to communicate air mover speed commands from the processing component to the air mover for controlling a speed of the air mover and a second wire configured to communicate tachometer information from the air mover to the processing component. The communication module may include a connector other than an air mover connector configured to couple the air mover to the first wire and the second wire and logic configured to monitor for an escape sequence communicated over the first wire from the processing component to enter a command mode and responsive to detecting the escape sequence, communicating information regarding the air mover to the processing component via the second wire.

Abstract: A system may include a cooling subsystem comprising at least one air mover configured to generate a cooling airflow in the system and a thermal manager communicatively coupled to the cooling subsystem for control of the cooling subsystem and configured to determine an acoustic limit associated with the cooling subsystem, correlate the acoustic limit to an acoustic-based air mover speed limit for the at least one air mover, and control the cooling subsystem to maintain an air mover speed of the at least one air mover below the acoustic-based air mover speed limit.

Abstract: An information handling system includes a processor that runs a maximum memory stress test of a memory module with a refresh rate of memory devices set to a first refresh rate. Then, the processor may receive a power consumption of the memory module. Also, the processor may receive the temperature of the memory devices, and may set the refresh rate to a second refresh rate. The processor may continuously receive both the power consumption of the memory module and the temperature of the memory devices. Based on the continuously received temperature, the processor may determine whether the temperature of the memory devices exceeds a second threshold temperature. If so, the processor may store a first setting as a refresh setting for the memory module. Otherwise, the processor may store a second setting as the refresh setting for the memory module.

Abstract: An information handling system includes a memory module having a first temperature sensor collocated with first memory devices associated with a first memory channel, and a second temperature sensor collocated with second memory devices associated with a second memory channel. A processor receives a first temperature from the first temperature sensor and a second temperature from the second temperature sensor, receives a first power level associated with the first memory channel and a second power level associated with the second memory channel from the memory module, determines a first thermal resistance of the first memory devices based upon the first temperature and the first power level, and determines a second thermal resistance of the second memory device based upon the second temperature and the second power level.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: Heat-rejecting media may thermally couple to a device, and the heat-rejecting media may include active heat-rejecting media configured to thermally couple to the device and thermally couple between the device and an active cooling system such that the active cooling system causes heat transferred to the active heat-rejecting media from the device to be transferred from the active heat-rejecting media and passive heat-rejecting media extending from the active heat-rejecting media and configured to thermally couple to the device and thermally couple between the device and a system-level air mover other than the active cooling system and configured to drive airflow to components of a system comprising the device such that the heat transferred to the passive heat-rejecting media from the device is transferred to the airflow driven by the system-level air mover.

Abstract: An information handling system may include a processor; a memory communicatively coupled to the processor; and a cooling system that includes a plurality of air movers and a cooling system controller. The cooling system controller may be configured to: store a data structure that includes information indicative of an expected number of air movers for the information handling system, wherein the expected number of air movers is based on configuration data for the information handling system; determine a detected number of air movers in the plurality of air movers of the cooling system; and in response to a determination that the expected number of air movers is not equal to the detected number of air movers, cause an alert to be sent to a user regarding an incorrect number of air movers.

Abstract: A dual in-line memory module (DIMM) thermal control system for intelligent DIMM thermal controls for maximum uptime may include a memory subsystem. The memory subsystem may include a first DIMM and a first serial presence detect (SPD) module associated with the first DIMM. The DIMM thermal control system may also include a baseboard management controller (BMC). The BMC may, when a first DIMM failure of the first DIMM may be detected, record a first failure event in a first failure events log of the first SPD module. The first failure event may comprise the first DIMM failure and associated first thermal telemetry data of the first DIMM. The BMC may also adjust DIMM thermal control settings to reduce temperature of the first DIMM based on the first failure events log including at least the first failure event.

Abstract: An information handling system includes a baseboard management controller (BMC) storing characterization data identifying a thermal resistance of a system component as a function of airflow. The BMC can perform measurements to determine a thermal resistance of the system component as a function of the speed of a system cooling fan. The BMC can determine a relationship between the fan speed and airflow at the information handling system based on the measurements and the characterization data.

Abstract: An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.

Abstract: An information handling system includes a rear node that includes an airflow control device a thermal manager. The thermal manager identifies a front node mating event between the rear node and a front node; in response to the front node mating event: obtains front node airflow characteristics for the front node; determines an airflow rate using, at least in part, the front node airflow characteristics; and sets an operating point of the airflow control device based on the airflow rate.

Abstract: An information handling system includes a baseboard management controller (BMC) storing characterization data identifying a thermal resistance of a system component as a function of airflow. The BMC can perform measurements to determine a thermal resistance of the system component as a function of the speed of a system cooling fan. The BMC can determine a relationship between the fan speed and airflow at the information handling system based on the measurements and the characterization data.

Abstract: An information handling system may include a circuit board that includes a plurality of expansion slots. The information handling system may further include a cooling card coupled to at least one of the plurality of expansion slots, and a processor coupled to the circuit board (but where the cooling card does not contain the processor). Further, the processor may include a heat exchanger coupled thereto. The cooling card may include a heatsink, and a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled to the heat exchanger.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a circuit board, a device communicatively coupled to the circuit board via an electrical interface, a temperature sensor for sensing a measured temperature associated with the device, an air mover, a heating element thermally coupled to the electrical interface, and a thermal control system. The thermal control system may be configured to receive a temperature signal from the temperature sensor indicative of the measured temperature, responsive to the measured temperature being above a maximum threshold temperature, control the air mover to generate airflow sufficient to at least reduce the measured temperature to below the maximum threshold temperature, and responsive to the measured temperature being below a minimum threshold temperature, control the heating element to cause the measured temperature to be maintained above the minimum threshold temperature.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.