Abstract: Disclosed are integrated circuits having multiple electromagnetically emissive devices, such as LC oscillators. The devices are formed on an integrated circuit substrate and are given different planar orientations from each other. Particular integrated circuit packages disclosed are “flip-chip” packages, in which solder bumps are provided on the integrated circuit substrate for flipping and mounting of the finished integrated circuit upon a printed circuit board or other substrate. The solder bumps provide conductive connections between the integrated circuit and the substrate. The orientations and positioning of the emissive devices are such that one or more of the solder bumps are interposed between neighboring emissive devices to act as an electromagnetic shield between them.

Abstract: A connector for electrically connecting to pads of a land grid array includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements formed on the first surface of the dielectric layer. Each contact element includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion. The elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer. Each elastic portion of the multiple number of contact elements elastically engages a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, each elastic portion has an elastic working range on the order of the electrical path length of the contact element.

Abstract: A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.

Abstract: A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.

Abstract: A connector for electrically connecting to pads of a land grid array includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements formed on the first surface of the dielectric layer. Each contact element includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion. The elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer. Each elastic portion of the multiple number of contact elements elastically engages a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, each elastic portion has an elastic working range on the order of the electrical path length of the contact element.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.

Abstract: A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.