Abstract: An integrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.

Abstract: A programmable transfer gate array generates control signals as functions of input variables in a digital logic circuit by using two-phase logic requiring no quiescent D.C. power consumption.

Abstract: Half-adder logic modules employing separate summing and carry circuitry are used in the construction of a modular binary half-adder. Carry bits of less significant digits are calculated independent of and prior to the calculation of corresponding sum bits, thus allowing rapid propagation of such carry bits to more significant digits and subsequent parallel summation of the sum bits using the carry bits previously calculated.