Abstract: An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Abstract: A semiconductor laser drive apparatus comprises a bias current setting section (232) which sets a bias current value on the basis of the drive temperature so that the temperature characteristic of the bias current value with respect to the drive temperature may be a linear function having a slope except zero and a drive current setting section (233) for setting the drive current value on the basis of the drive temperature so that the temperature characteristic of the drive current value with respect to the drive temperature may be a function having a slope except zero. The temperature characteristic of the bias current and that of the drive current are functions different from each other. With this, low cost, space-saving, and power-saving of a semiconductor laser are achieved, and a semiconductor laser drive apparatus enabling a good transmission characteristic on the reception side and a high optical output over the whole drive temperature range when driving the semiconductor laser can be provided.

Abstract: An optical wiring mounted on an electronic device has a light transmission path for transmitting an optical signal. A function layer that reduces friction generated when coming in contact with a structural body in the electronic device to lower than when the light transmission path comes in contact with the structural body, and that bends according to deformation of the light transmission path, is arranged.

Abstract: A connection member (21), which electrically connects a package (14) on which an optical element that converts an electric signal to an optical signal or converts an optical signal to an electric signal and at least one end portion including an incident/releasing port for an optical signal of an optical waveguide (11) that is optically coupled with the optical element to transmit the optical signal are mounted, and a second substrate (2) to each other, is provided with a holding unit having elasticity, which holds the package (14), and a connection unit that is connected to the substrate (2).

Abstract: An optical cable module is mainly provided with: an optical waveguide (10), a light-receiving element (11) and a supporting substrate (14) at its end portion of the light releasing side. The end portion of the optical waveguide (10) is fixed in its relative positional relationship with the light-receiving element (11). The end face of the optical waveguide (10) is not made perpendicular to the light axis (X-axis), and is diagonally cut so as to form an optical path conversion mirror (10D). Assuming that a light ray (indicated by a solid line in the Figure) that passes through the center of the light-axis cross section of a core (10A), and is reflected by the optical path conversion mirror (10D), and then reaches a light-receiving face at a light axis reflection position, the center of the light-receiving element (11) is placed with a gap from the light axis reflection position, in the optical cable module (1).

Abstract: A method of manufacturing a film waveguide includes the steps of: molding a first clad layer formed with a concave groove for core filling, molding a second clad layer, and laminating the surface formed with the concave groove of the first clad layer and the second clad layer using resin having a flexural modulus of smaller than or equal to 1,000 MPa. The resin contains hydrogen bonding group in a functional group of a precursor and having a refraction index higher than the clad layers, and forming a core in the concave groove by the resin. The lamination and the formation of the core is performed at the same time.

Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for support

Abstract: This invention provides an optical transmission module that is of low cost and that can be mounted even in a narrow space. An optical transmission module of the present invention includes a light reception processing section for converting an optical signal transmitted by an optical wiring to an electric signal, a reception side substrate part including an electric wiring for transmitting the electric signal, and a reception side connector section for providing the electric signal to the light reception processing section and the reception side substrate part. The light reception processing section and the reception side connector section are mounted on a same substrate surface of the reception side substrate part, and the reception side substrate part includes a bending portion bent so that the substrate surfaces oppose each other at the back in the normal direction.

Abstract: It is possible to reduce a noise component mixed in an analog signal while suppressing increase of power consumption. An amplification unit amplifies the inputted analog signal and converts the amplified signal into a digital signal of a predetermined format for output. The amplification unit includes: an analog circuit unit for processing an analog signal; and a digital circuit unit for processing a digital signal; wherein the circuits are arranged on a substrate. The analog circuit unit includes: an amplification circuit for amplifying the inputted analog signal; and an LPF for cutting off a high frequency component of the amplified analog signal. The digital circuit unit includes: a rectification circuit which rectifies a waveform of the signal whose high-frequency component is cut off; and digital output circuit which converts the waveform-rectified signal into a digital signal of a predetermined format for output.

Abstract: An optical transmission module has an optical transmission path in which optical transmission is performed between a first circuit board and a second circuit board disposed opposite the first circuit board. The optical transmission path has a folded structure having a bending radius. A circumferential portion drawn by the bending radius is provided substantially perpendicular to board surfaces of the first circuit board and the second circuit board.

Abstract: A transmission device has a light emitting element for converting an electric signal to an optical signal and transmitting the same, and a drive section for outputting the optical signal from the light emitting element and driving the light emitting element by providing the electric signal to the light emitting element. The electric signal provided by the drive section to the light emitting element is a waveform deformed signal having a waveform in which a time required for a fall is longer than a time required for a rise in a binary signal having a signal of high level and a signal of low level.

Abstract: A serializer is equipped with a plurality of input terminals into which a plurality of binary signals are input in parallel, and converts the plurality of input binary signals into serial binary signals and transmits the serial binary signals to an optical transmission module. One input terminal out of the plurality of input terminals is assigned as an input terminal for preventing bit continuation by inserting “1” signals or “0” signals into the serial binary signals so that a predetermined number of bits of the same value may not be inserted continuously. Due to this structure, bit continuation can be prevented even for a signal generating source with no coding function by a simple configuration without increasing cost and size.

Abstract: An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.

Abstract: An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.

Abstract: A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.

Abstract: An optical transmission module has a light-emitting element, a light-receiving element, and an optical path for optically coupling the light-emitting element and the light-receiving element, and transmitting a optical signal. The optical path has a core part, a clad part surrounding the core part, and a support board for supporting the optical path itself and the light-receiving element. A resin part formed of resin having a refractive index higher than air outside the optical path is arranged at a part of a surface area of the clad part along an optical transmission direction to which optical signals are transmitted. The resin part has an inclined surface in which the surface on the opposite side of the clad part is tilted relative to the optical transmission direction. The inclined surface forms an acute angle with the surface of the clad part at the opposite side of the light-receiving element in the resin part.

Abstract: A light transmission module has a light transmission path for transmitting light, an optical element including a light emitting and receiving surface for emitting or receiving an optical signal transmitted by the light transmission path, and having a light emitting and receiving point with a function of photoelectric conversion and an electrode pad formed on the light emitting and receiving surface, a substrate mounted with the optical element and an electrical wiring, a bonding wiring for electrically connecting the electrode pad and the electrical wiring, and a sealing portion for sealing the optical element. The electrical wiring and the electrode pad are reverse wire-bonded by the bonding wiring.

Abstract: An optical cable module is mainly provided with: an optical waveguide (10), a light-receiving element (11) and a supporting substrate (14) at its end portion of the light releasing side. The end portion of the optical waveguide (10) is fixed in its relative positional relationship with the light-receiving element (11). The end face of the optical waveguide (10) is not made perpendicular to the light axis (X-axis), and is diagonally cut so as to form an optical path conversion mirror (10D). Assuming that a light ray (indicated by a solid line in the Figure) that passes through the center of the light-axis cross section of a core (10A), and is reflected by the optical path conversion mirror (10D), and then reaches a light-receiving face at a light axis reflection position, the center of the light-receiving element (11) is placed with a gap from the light axis reflection position, in the optical cable module (1).

Abstract: In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22).

Abstract: A light emitting element circuit has a light emitting element, a drive circuit that supplies a current to the light emitting element, and a signal circuit that autonomously supplies a signal according to an ambient temperature. The signal adjusts the current such that the current corresponds to a temperature characteristic of the light emitting element.