Abstract: A coil component has a first surface and a second surface facing each other. The coil component has a coil conductor formed into a spiral shape, an insulating resin layer covering the coil conductor, a magnetic resin layer disposed on the first surface side of the insulating resin layer without being disposed on the second surface side of the insulating resin layer, and an external terminal disposed at least on one surface on the first surface side of the magnetic resin layer and electrically connected to the coil conductor. The magnetic resin layer is made of a composite material of a resin and a metal magnetic powder. The external terminal includes a metal film contacting the resin and the metal magnetic powder of the magnetic resin layer.

Abstract: An inductor component has a plurality of layers of spiral wirings a magnetic composite body directly or indirectly covering the plurality of layers of spiral wirings and made of a composite material of a resin and a metal magnetic powder with an average particle diameter of 5 ?m or less an internal electrode embedded in the magnetic composite body with an end surface exposed from an outer surface of the magnetic composite body, the internal electrode being electrically connected to the spiral wirings, and an external terminal disposed on the outer surface of the magnetic composite body and electrically connected to the internal electrode.

Abstract: An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.

Abstract: There is provided a common mode choke coil in which a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer and two facing conductive coils are included in the non-magnetic layer, the non-magnetic layer is formed of sintered glass ceramics, the conductive coils and are formed of a conductor containing copper, and at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing Fe2O3, Mn2O3, NiO, ZnO and CuO. The sintered ferrite material has an Fe2O3-reduced content of 25 to 47 mol % and a Mn2O3-reduced content of 1 to 7.5 mol %, or Fe2O3-reduced content of 35 to 45 mol % and a Mn2O3-reduced content of 7.5 to 10 mol %, and a CuO reduced content of 5 mol %.

Abstract: There is provided a common mode choke coil in which a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer and two facing conductive coils are included in the non-magnetic layer, the non-magnetic layer is formed of sintered glass ceramics, the conductive coils and are formed of a conductor containing copper, and at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing Fe2O3, Mn2O3, NiO, ZnO and CuO. The sintered ferrite material has an Fe2O3-reduced content of 25 to 47 mol % and a Mn2O3-reduced content of 1 to 7.5 mol %, or Fe2O3-reduced content of 35 to 45 mol % and a Mn2O3-reduced content of 7.5 to 10 mol %, and a CuO reduced content of 5 mol %.

Abstract: An elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.

Abstract: An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps.

Abstract: A piezoelectric device includes a piezoelectric substrate, a conductive pattern which is provided on one main surface of the piezoelectric substrate and which includes an IDT electrode, a supporting layer which is arranged on the one main surface of the piezoelectric substrate so as to surround the periphery of an IDT-forming region in which the IDT electrode is provided and which has a thickness greater than that of the IDT electrode, and a cover layer which is arranged on the supporting layer and which covers the IDT-forming region. The supporting layer includes removed sections provided at a plurality of positions at least in a region close to the IDT-forming region, the removed sections being obtained by partially removing a portion of the supporting layer to be bonded to the one main surface of the piezoelectric substrate.

Abstract: A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.

Abstract: An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps.

Abstract: A piezoelectric device includes a piezoelectric substrate, a conductive pattern which is provided on one main surface of the piezoelectric substrate and which includes an IDT electrode, a supporting layer which is arranged on the one main surface of the piezoelectric substrate so as to surround the periphery of an IDT-forming region in which the IDT electrode is provided and which has a thickness greater than that of the IDT electrode, and a cover layer which is arranged on the supporting layer and which covers the IDT-forming region. The supporting layer includes removed sections provided at a plurality of positions at least in a region close to the IDT-forming region, the removed sections being obtained by partially removing a portion of the supporting layer to be bonded to the one main surface of the piezoelectric substrate.

Abstract: A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.

Abstract: A chip inductor is constructed by alternately laminating plural conductor patterns and plural insulating layers on and above a ceramic substrate, and connecting the plural conductor patterns to each other in series in a lamination direction thereof so as to constitute a coil. Specifically, the number of turns of the lowermost conductor pattern disposed directly on the ceramic substrate is larger than the number of turns of the other plural conductor patterns and the number of turns of the other plural conductor patterns are substantially equal to each other. Preferably, the number of turns of the lowermost conductor pattern is about 1.5 times the number of turns of the other plural conductor patterns.

Abstract: A chip inductor in which excellent Q characteristic is realized while advantages in its small size and low profile are ensured, as well as a method for manufacturing the same, is provided. A chip inductor 1 is constructed by alternately laminating plural conductor patterns 31, 32, 33, and 34 and plural insulating layers 35, 36, 37, and 38 on and above a ceramic substrate 2, and connecting these plural conductor patterns 31, 32, 33, and 34 to each other in series in the lamination direction thereof so as to constitute a coil 30. Specifically, the number of turns of the lowermost-layer conductor pattern 31 disposed immediately on the ceramic substrate 2 is specified to be larger than the numbers of turns of the other plural conductor patterns 32, 33, and 34, and the numbers of turns of the other plural conductor patterns 32, 33, and 34 are specified to be substantially equal to each other. Preferably, the number of turns of the conductor pattern 31 is specified to be about 1.