Patents by Inventor Hayase Gaku
Hayase Gaku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10627165Abstract: Disclosed herein is a heat exchanger, and more particularly to a heat exchanger having an improved refrigerant flow structure. The heat exchanger includes a plurality of tubes arranged in a first row and a second row, a first header connected to one end of the plurality of the first row tubes and a second header connected to one end of the plurality of the second row tubes, a first baffle dividing an inside of the first header into a first channel and a second channel in a vertical direction and dividing an inside of the second header into a third channel and a fourth channel in a vertical direction, an inlet pipe connected to the second channel to allow the refrigerant to flow therein, and an outlet pipe connected to the third channel to discharge the refrigerant.Type: GrantFiled: September 13, 2017Date of Patent: April 21, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Kang Tae Seo, Jeung Ku Choi, Young Min Kim, Yong-Hwa Choi, Hayase Gaku
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Patent number: 10527366Abstract: A heat exchanger includes a plurality of tubes having refrigerant flowing therein and arranged to exchange heat with outside air; and a header having a chamber adapted to distribute the refrigerant to the plurality of tubes, wherein the header includes, a base wall having a plurality of tube insertion holes into which the plurality of tubes are inserted, and a partition wall integrally formed with the base wall and configured to divide the chamber into a plurality of sections corresponding to the plurality of tubes. This structure helps reduce the number of parts of the heat exchanger, simplify processing and assembling, and improving the heat transfer performance by improving the distribution of the refrigerant.Type: GrantFiled: September 8, 2017Date of Patent: January 7, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong Hyun Kim, Jun Kyu Jung, Young Min Kim, Hayase Gaku
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Publication number: 20180073809Abstract: Disclosed herein is a heat exchanger, and more particularly to a heat exchanger having an improved refrigerant flow structure. The heat exchanger includes a plurality of tubes arranged in a first row and a second row, a first header connected to one end of the plurality of the first row tubes and a second header connected to one end of the plurality of the second row tubes, a first baffle dividing an inside of the first header into a first channel and a second channel in a vertical direction and dividing an inside of the second header into a third channel and a fourth channel in a vertical direction, an inlet pipe connected to the second channel to allow the refrigerant to flow therein, and an outlet pipe connected to the third channel to discharge the refrigerant.Type: ApplicationFiled: September 13, 2017Publication date: March 15, 2018Inventors: Kang Tae Seo, Jeung Ku Choi, Young Min Kim, Yong-Hwa Choi, Hayase Gaku
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Publication number: 20180073819Abstract: A heat exchanger includes a plurality of tubes having refrigerant flowing therein and arranged to exchange heat with outside air; and a header having a chamber adapted to distribute the refrigerant to the plurality of tubes, wherein the header includes, a base wall having a plurality of tube insertion holes into which the plurality of tubes are inserted, and a partition wall integrally formed with the base wall and configured to divide the chamber into a plurality of sections corresponding to the plurality of tubes. This structure helps reduce the number of parts of the heat exchanger, simplify processing and assembling, and improving the heat transfer performance by improving the distribution of the refrigerant.Type: ApplicationFiled: September 8, 2017Publication date: March 15, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong Hyun KIM, Jun Kyu Jung, Young Min Kim, Hayase Gaku
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Patent number: 9903667Abstract: A distribution structure of a heat exchanger includes one inlet pipe connected to a header. The heat exchanger includes a first header having a first chamber and a second chamber, a second header having a third chamber and a fourth chamber, and a plurality of tubes arranged in a plurality of rows. An inlet pipe is connected to the first chamber and an outlet pipe is connected to the second chamber. A distributer distributes the refrigerant flowing into the first chamber to the tubes of the front row, the distributor includes a first separating baffle dividing the first chamber into a mixing chamber in which the refrigerant is mixed and a supplying chamber for supplying the refrigerant to the tubes, a distribution pipe communicating the mixing chamber with the supplying chamber, and a second separating baffle dividing the supplying chamber into a plurality of independent chambers.Type: GrantFiled: April 17, 2014Date of Patent: February 27, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kan Tae Seo, Yong Ki Baek, Hayase Gaku
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Patent number: 9546824Abstract: A heat exchanger includes first and second heat exchanging units arranged between first and second header units, and a plurality of refrigerant circuits each defining a refrigerant path, through which refrigerant introduced into the first header unit is discharged out of the first header unit after exchanging heat in the first and second heat exchanging units.Type: GrantFiled: October 27, 2011Date of Patent: January 17, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae Seo, Hong Gi Cho, Hayase Gaku
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Patent number: 8973647Abstract: A heat exchange fin in a heat exchanger is disposed between two refrigerant pipes spaced apart from each other includes a guide protrusion including first inclined planes inclined upward along opposite sides of a center line of a refrigerant pipe row in a symmetric fashion and second inclined planes inclined downward from upper ends of the first inclined planes, and the first inclined planes and the second inclined planes are provided with louver members, thereby improving heat exchange efficiency.Type: GrantFiled: October 26, 2010Date of Patent: March 10, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Kang Tae Seo, Hayase Gaku, Young Min Kim, Dong Ho Park
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Publication number: 20140366568Abstract: A heat exchanger includes a refrigerant pipe through which a refrigerant flows, and a plurality of fins coupled to an outer circumference surface of the refrigerant pipe, wherein each fin includes a first region disposed upstream with respect to an air flow direction, and a second region which forms a boundary with the first region and is disposed downstream with respect to the air flow direction, and wherein the first region and the second region have different surface energies in order to prevent formation of condensation water on the fin.Type: ApplicationFiled: April 3, 2014Publication date: December 18, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hong Suk KIM, Seung Hoon Kal, Myong Jong Kwon, Seung Jin Oh, Choong Hyo Jang, Yong Hwa Choi, Hayase Gaku, Sung Hun Hong
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Publication number: 20140311714Abstract: A distribution structure of a heat exchanger includes one inlet pipe connected to a header. The heat exchanger includes a first header having a first chamber and a second chamber, a second header having a third chamber and a fourth chamber, and a plurality of tubes arranged in a plurality of rows. An inlet pipe is connected to the first chamber and an outlet pipe is connected to the second chamber. A distributer distributes the refrigerant flowing into the first chamber to the tubes of the front row, the distributor includes a first separating baffle dividing the first chamber into a mixing chamber in which the refrigerant is mixed and a supplying chamber for supplying the refrigerant to the tubes, a distribution pipe communicating the mixing chamber with the supplying chamber, and a second separating baffle dividing the supplying chamber into a plurality of independent chambers.Type: ApplicationFiled: April 17, 2014Publication date: October 23, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae SEO, Yong Ki BAEK, Hayase GAKU
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Publication number: 20140096944Abstract: A heat exchanger having an improved distribution structure in which one inlet pipe is connected to a header which is partitioned into a first sub-chamber in which a refrigerant flows through the inlet pipe and a second sub-chamber in which tubes communicate with each other, and a distribution pipe is installed at the header and causes the first sub-chamber and the second sub-chamber to communicate so that the refrigerant in the first sub-chamber can be distributed to the tubes. The distribution pipe can pass through and can be combined with a partitioning baffle that is combined with the header to partition a chamber of the header into the first sub-chamber and the second sub-chamber.Type: ApplicationFiled: October 2, 2013Publication date: April 10, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Kang Tae SEO, Yong Ki Baek, Seung Hee Ha, Hayase Gaku
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Publication number: 20140083664Abstract: A heat exchanger having an improved structure which allows refrigerant tubes to be firmly bonded to heat exchange fins. The heat exchanger includes a plurality of refrigerant tubes spaced apart from each other, headers coupled to both end portions of the refrigerant tubes, and heat exchange fins coupled to the refrigerant tubes and disposed spaced apart from each other. Each of the heat exchange fins includes insertion grooves allowing the refrigerant tubes to be inserted thereinto, and bonding plates bonded to the refrigerant tubes. Each of the bonding plates includes a first bonding portion curved from one end portion thereof in a first direction and bonded to one surface of a corresponding one of the refrigerant tubes, and a second bonding portion curved from the other end portion thereof in a second direction and bonded to the other surface of the corresponding one of the refrigerant tubes.Type: ApplicationFiled: September 19, 2013Publication date: March 27, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Hwa CHOI, Dong Hyun Kim, Hayase Gaku, Yong Min Kim
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Publication number: 20120103585Abstract: A heat exchanger includes first and second heat exchanging units arranged between first and second header units, and a plurality of refrigerant circuits each defining a refrigerant path, through which refrigerant introduced into the first header unit is discharged out of the first header unit after exchanging heat in the first and second heat exchanging units.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae Seo, Hong Gi Cho, Hayase Gaku
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Publication number: 20120103583Abstract: A heat exchanger having a structure in which micro-channel tubes are respectively fitted into both sides of corresponding flat fins for heat exchange, thereby achieving enhancements in drainage and heat transfer performance. The heat exchanger includes a first header connected with an inflow tube and an outflow tube, a second header spaced apart from the first header by a desired distance and arranged parallel to the first header, a plurality of flat micro-channel tubes arranged in a front row and a rear row between the first header and the second header, and a plurality of plate type fins. Each of the micro-channel tubes includes micro-channels. Each of the fins includes slots arranged in a front row and a rear row to respectively fit the front row and rear row micro-channel tubes into the slots.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young Min Kim, Hayase Gaku, Kang Tae Seo
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Publication number: 20120103582Abstract: A heat exchanger having a structure in which micro-channel tubes are respectively fitted into both sides of corresponding flat fins for heat exchange, thereby achieving enhancements in drainage and heat transfer performance. The heat exchanger includes a first header extending vertically and connected with an inflow tube and an outflow tube, a second header spaced apart from the first header by a desired distance and arranged parallel to the first header, and a plurality of flat micro-channel tubes arranged horizontally while being vertically spaced apart from one another by a desired clearance and arranged in a front row and a rear row between the first header and the second header. Micro-channels are formed in each of the micro-channel tubes.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young Min Kim, Hayase Gaku, Dong Hyun Kim
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Publication number: 20120103581Abstract: A header unit includes a body and a cover coupled to the body. The body supports outer and inner sides of the cover in a simultaneous manner. In accordance with this structure, refrigerant can flow in a heat exchanger for cooling/heating purposes requiring high operating pressure of refrigerant.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae Seo, Hong Gi Cho, Hayase Gaku, Dong Hyun Kim, Yong Hwa Choi
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Publication number: 20120103587Abstract: A heat exchanger includes a refrigerant pipe in which a refrigerant flows and a heat exchanger fin coupled to the outer circumference of the refrigerant pipe. The heat exchanger fin includes a plate, a protrusion protruding from the plate, slits disposed at opposite sides of the protrusion to guide air to the protrusion, and a louver unit provided at the protrusion to perform heat exchange with the air having passed through the slits.Type: ApplicationFiled: October 24, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong Ho Park, Hayase Gaku, Kang Tae Seo, Young Min Kim
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Publication number: 20110120681Abstract: A heat exchange fin in a heat exchanger is disposed between two refrigerant pipes spaced apart from each other includes a guide protrusion including first inclined planes inclined upward along opposite sides of a center line of a refrigerant pipe row in a symmetric fashion and second inclined planes inclined downward from upper ends of the first inclined planes, and the first inclined planes and the second inclined planes are provided with rubber members, thereby improving heat exchange efficiency.Type: ApplicationFiled: October 26, 2010Publication date: May 26, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kang Tae Seo, Hayase Gaku, Young Min Kim, Dong Ho Park
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Publication number: 20060020435Abstract: A method of predicting a noise of an air conditioner, including modeling an operating condition, e.g., a shape of a heat exchanger or of a fan, a rotational speed of the fan, etc., obtaining information of a velocity of air by analyzing an air flow according to the modeled operating condition, and predicting a noise by analyzing the information of the velocity of air. A method of manufacturing an air conditioner, including modeling an operating condition, e.g., a shape of a heat exchanger or of a fan, a rotational speed of the fan, etc., predicting a noise by analyzing a velocity distribution of air at the rear of the heat exchanger in a modeled air conditioner, and determining whether a predicted noise is above a predetermined level, followed by remodeling the operating condition when the predicted noise is above the predetermined level, otherwise by manufacturing the air conditioner.Type: ApplicationFiled: June 13, 2005Publication date: January 26, 2006Inventors: Yong Choi, Hayase Gaku