Patents by Inventor Hayato Hasegawa
Hayato Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240077373Abstract: A force sensor module according to an embodiment of the present disclosure includes a plurality of force sensors. Each of the force sensor includes a plurality of sensor sections having force detection directions different from each other, and a flexible rubber member that is provided to cover the plurality of sensor sections. The rubber member is configured to transmit a force inputted from outside to the plurality of force sensors by deformation corresponding to the force.Type: ApplicationFiled: December 16, 2021Publication date: March 7, 2024Inventors: TOMOKO KATSUHARA, HIDETOSHI MIYASHITA, RUI KAMADA, KIYOKAZU MIYAZAWA, TOSHIMITSU TSUBOI, HAYATO HASEGAWA
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Patent number: 11867580Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: GrantFiled: June 10, 2022Date of Patent: January 9, 2024Assignee: SONY GROUP CORPORATIONInventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
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Patent number: 11725992Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.Type: GrantFiled: December 28, 2018Date of Patent: August 15, 2023Assignee: SONY CORPORATIONInventors: Ken Kobayashi, Akira Ebisui, Yoshiaki Sakakura, Tomoko Katsuhara, Hayato Hasegawa, Manami Miyawaki
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Patent number: 11592941Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.Type: GrantFiled: March 6, 2019Date of Patent: February 28, 2023Assignee: SONY CORPORATIONInventors: Akira Ebisui, Ken Kobayashi, Hayato Hasegawa, Yoshiaki Sakakura, Manami Miyawaki
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Publication number: 20220390303Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: ApplicationFiled: June 10, 2022Publication date: December 8, 2022Applicant: SONY GROUP CORPORATIONInventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
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Patent number: 11402283Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: GrantFiled: September 14, 2017Date of Patent: August 2, 2022Assignee: SONY CORPORATIONInventors: Tomoko Katsuhara, Akira Ebisui, Taizo Nishimura, Ken Kobayashi, Tetsuro Goto, Yoshiaki Sakakura, Kei Tsukamoto, Hayato Hasegawa, Manami Miyawaki
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Patent number: 11397499Abstract: [Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.Type: GrantFiled: November 28, 2019Date of Patent: July 26, 2022Assignee: SONY GROUP CORPORATIONInventors: Akira Ebisui, Ken Kobayashi, Yoshiaki Sakakura, Hayato Hasegawa, Manami Miyawaki
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Publication number: 20220027017Abstract: [Object] To provide a technology such as a pressure-sensitive sensor that can sufficiently ensure tolerances. [Solving Means] A pressure-sensitive sensor according to the present technology includes a sensor section, a clearance layer, and a push-in layer. The sensor section includes a sensor electrode layer, a first reference electrode layer, and a first deformable layer that is situated between the sensor electrode layer and the first reference electrode layer. The clearance layer is situated outside of the sensor section to face the first reference electrode layer. The push-in layer is situated between the first reference electrode layer and the clearance layer, and pushes the first reference electrode layer toward the sensor electrode layer in response to an external force to deform the first deformable layer.Type: ApplicationFiled: November 28, 2019Publication date: January 27, 2022Inventors: AKIRA EBISUI, KEN KOBAYASHI, YOSHIAKI SAKAKURA, HAYATO HASEGAWA, MANAMI MIYAWAKI
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Publication number: 20210181897Abstract: An electronic apparatus includes: an exterior body; a pressure-sensitive sensor having a sensing face; and a support supporting the pressure-sensitive sensor such that inner faces the exterior body is opposed to the sensing face.Type: ApplicationFiled: September 14, 2017Publication date: June 17, 2021Applicant: SONY CORPORATIONInventors: Tomoko KATSUHARA, Akira EBISUI, Taizo NISHIMURA, Ken KOBAYASHI, Tetsuro GOTO, Yoshiaki SAKAKURA, Kei TSUKAMOTO, Hayato HASEGAWA, Manami MIYAWAKI
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Patent number: 10936128Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: GrantFiled: August 26, 2019Date of Patent: March 2, 2021Assignee: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Publication number: 20210041973Abstract: Electronic equipment includes a pressed body as either a housing or a display, a pressure-sensitive sensor, a support configured to support the pressure-sensitive sensor such that the pressure-sensitive sensor is opposed to the pressed body, and a filler provided between the pressed body and the pressure-sensitive sensor. The filler has a thickness that changes with distance between the pressed body and the pressure-sensitive sensor.Type: ApplicationFiled: March 6, 2019Publication date: February 11, 2021Inventors: AKIRA EBISUI, KEN KOBAYASHI, HAYATO HASEGAWA, YOSHIAKI SAKAKURA, MANAMI MIYAWAKI
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Publication number: 20200348191Abstract: A sensor includes a capacitive sensor electrode layer, a reference electrode layer, and an elastic layer provided between the sensor electrode layer and the reference electrode layer. A thickness of the elastic layer is 100 ?m or less, and a weight per unit area of the elastic layer is less than 3 mg/cm2.Type: ApplicationFiled: December 28, 2018Publication date: November 5, 2020Inventors: KEN KOBAYASHI, AKIRA EBISUI, YOSHIAKI SAKAKURA, TOMOKO KATSUHARA, HAYATO HASEGAWA, MANAMI MIYAWAKI
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Publication number: 20200097106Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: ApplicationFiled: August 26, 2019Publication date: March 26, 2020Applicant: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 10386971Abstract: A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.Type: GrantFiled: July 23, 2014Date of Patent: August 20, 2019Assignee: SONY CORPORATIONInventors: Taizo Nishimura, Fumihiko Iida, Hiroshi Mizuno, Yasuyuki Abe, Takayuki Tanaka, Hayato Hasegawa, Shogo Shinkai
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Patent number: 10282041Abstract: Provided is a sensor device, including: a deformable first surface; a second surface facing the first surface; an electrode board between the first surface and the second surface, the electrode board including a plurality of capacitive elements arranged in a matrix; a support including a first support layer and a second support layer, the first support layer including a plurality of first columns, the second support layer being layered on the first support layer, the support being deformable following deformation of the first surface, the support connecting at least one of the first surface and the second surface to the electrode board; and a conductor layer supported by the support.Type: GrantFiled: March 18, 2015Date of Patent: May 7, 2019Assignee: Sony CorporationInventors: Shogo Shinkai, Hiroto Kawaguchi, Hiroshi Mizuno, Taizo Nishimura, Fumihiko Iida, Kei Tsukamoto, Hayato Hasegawa, Tomoko Katsuhara
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Patent number: 10055067Abstract: [Object] To provide a sensor device capable of detecting an operation position and a pressing force with high accuracy. [Solution] A sensor device includes a first conductor layer, an electrode substrate, and a plurality of first structural bodies configured to separate the first conductor layer from the electrode substrate. At least one of the first conductor layer and the electrode substrate has flexibility. The electrode substrate includes a plurality of first electrodes and a plurality of second electrodes intersecting the plurality of first electrodes. At least one of the first and second electrodes includes a plurality of sub-electrodes.Type: GrantFiled: February 6, 2014Date of Patent: August 21, 2018Assignee: Sony CorporationInventors: Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hiroto Kawaguchi, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Publication number: 20180088709Abstract: There is provided a sensor device includes a sheet-like first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at paired portions of the first and second electrode wires, and a sheet substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.Type: ApplicationFiled: October 14, 2017Publication date: March 29, 2018Applicant: Sony CorporationInventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Publication number: 20170364182Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: ApplicationFiled: September 1, 2017Publication date: December 21, 2017Applicant: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9811226Abstract: There is provided a sensor device that includes a flexible first conductor layer and an electrode substrate. The electrode substrate includes a plurality of first electrode wires, a plurality of second electrode wires, capacity sensors being formed at capacitively coupled portions of the first and second electrode wires, and a flexible substrate that supports the first and second electrode wires. The sensor device also includes a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate.Type: GrantFiled: August 22, 2014Date of Patent: November 7, 2017Assignee: Sony CorporationInventors: Takashi Itaya, Shogo Shinkai, Hiroto Kawaguchi, Fumihiko Iida, Hayato Hasegawa, Kei Tsukamoto, Takayuki Tanaka, Tomoko Katsuhara, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe
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Patent number: 9785297Abstract: The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.Type: GrantFiled: December 6, 2013Date of Patent: October 10, 2017Assignee: Sony CorporationInventors: Hiroto Kawaguchi, Shogo Shinkai, Kei Tsukamoto, Tomoko Katsuhara, Hayato Hasegawa, Fumihiko Iida, Takayuki Tanaka, Tomoaki Suzuki, Taizo Nishimura, Hiroshi Mizuno, Yasuyuki Abe