Patents by Inventor Hayato Nasu

Hayato Nasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070001307
    Abstract: A semiconductor device includes a guard ring formed in an inter-level insulating film on a semiconductor substrate to surround an element forming region on the semiconductor substrate and containing Cu as a main component. And the device further includes a first barrier film formed on an interface between the inter-level insulating film and the guard ring and containing a compound of a preset metal element and a constituent element of the inter-level insulating film as a main component.
    Type: Application
    Filed: May 25, 2006
    Publication date: January 4, 2007
    Inventors: Takamasa Usui, Hayato Nasu, Hideki Shibata
  • Publication number: 20070004049
    Abstract: A semiconductor device includes a gate insulating film which at least includes a first insulating film formed on the main surface of a semiconductor substrate and a first ferroelectric film formed on the first insulating film, containing a compound of a preset metal element and a constituent element of the first insulating film as a main component and having a dielectric constant larger than that of the first insulating film, a gate electrode formed on the gate insulating film and containing one of Cu and a material containing Cu as a main component, and source and drain regions separately formed in the semiconductor substrate to sandwich the gate electrode.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 4, 2007
    Inventors: Hayato Nasu, Takamasa Usui, Hideki Shibata
  • Publication number: 20050218519
    Abstract: A semiconductor device includes an interlevel insulating film disposed on a semiconductor substrate and having an opening formed therein. An interconnection main layer, which contains Cu as a main component, is embedded in the opening. A barrier film is interposed between the interlevel insulating film and the interconnection main layer within the opening. The barrier film contains, as a main component, a compound of a predetermined metal element with a component element of the interlevel insulating film.
    Type: Application
    Filed: February 24, 2005
    Publication date: October 6, 2005
    Inventors: Junichi Koike, Makoto Wada, Shingo Takahashi, Noriyoshi Shimizu, Hideki Shibata, Satoshi Nishikawa, Takamasa Usui, Hayato Nasu, Masaki Yoshimaru
  • Patent number: 4771986
    Abstract: This invention relates to a jack of a pantograph type, especially to the improvement of pivot joint mechanism of jack comprising screw nut body engaged with screw, metal body having screw bearing hole and end portions of a pair of upper and lower grooved links, and constituted by combining the upper and the lower grooved links with the screw block in which the screw block having unidiameter passes through an inserting hole formed on two side wall portions of end portions of the upper and lower grooved links to extend the two end portions of screw block for projecting outwardly. In this state, a plurality of projections for stopping are formed by plastic working with separating each other around axial periphery on the portions of screw block adjacent to inner and outer face of two side wall portions of the upper and lower grooved links respectively.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: September 20, 1988
    Assignee: Michael Hung
    Inventor: Hayato Nasu