Abstract: A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a design for protection for the transmission of higher amplitude outputs required of differential amplifiers formed by thin oxide transistors with limited maximum voltage tolerance used where compliance with communication protocol standards requires handling voltages which may, in transition, exceed desirable levels is provided by limiting the voltage across any two device terminals under power down conditions.

Abstract: Apparatuses and methods comprise a phase shifter, an adjustable capacitance configured to adjust a phase shift of said phase shifter, an arbitrary waveform generator configured to adjust the adjustable capacitance, and a pulse pattern generator coupled to the phase shifter, the phase shifter is configured to control the pulse pattern generator. In one aspect, an adjustable capacitance is at least one varactor diode. In another, a pair of varactor diodes are separated by ?/4 lines, an input and an output of the adjustable capacitance is AC-coupled, and the arbitrary waveform generator is configured to adjust the adjustable capacitance through a gaussian noise signal input to the pair of varactor diodes. A deterministic jitter generator may be coupled to the pulse pattern generator. An open-circuited stub line may be input to the pattern generator, a deterministic jitter content number adjustable varying stub line length.

Abstract: An (SST) driver circuit having additional circuitry for minimizing data-dependent jitter in the SST driver and increasing frequency amplitude in the SST driver. The additional circuity comprises a plurality of switches configured to be turned on or pulsed on momentarily during operation to discharge a node in the SST output stage for the purpose of removing the stored charge before the next transition cycle of the output stage.

Abstract: A clock distribution network, structure, and method for providing balanced loading is disclosed. In particular, a clock distribution network may be formed of one or more clock fanout distribution levels. Each respective distribution level may include an equal number of buffer circuits and wiring routes that have substantially identical physical and electrical properties. Additionally, a final distribution level may include wiring routes that have substantially identical physical and electrical properties connecting buffer circuits to one or more logic leaf connection nodes.

Abstract: A body-biased enhanced current mirror circuit is disclosed wherein the body voltage of a current mirror device is adjusted to compensate for the effect of changes in the output voltage on the output current, increasing the output impedance. For each instance of the current mirror, this approach has the advantage of requiring no additional margin in operating voltage and of consuming no more circuit area than prior art current mirror designs. In addition, the body-biased enhanced current mirror circuit provides a stable reference current to output current ratio over a wide operating range. An auxiliary MOSFET current mirror device with the body connected to ground may be added in parallel with the body-biased current mirror device to eliminate a non-monotonicity of the current output.

Abstract: Analog supply for an analog circuit and process for supplying an analog signal to an analog circuit. The analog supply includes a noise filter having a variable resistor, and a control device coupled to adjust the variable resistor. The control device is structured and arranged to set the resistance of the variable resistor to maximize noise filtering and optimize performance of the analog circuit.

Abstract: A shifter circuit includes a pair of feed forward sections and a pair of feedback sections. The sections are arranged and coupled to form a balanced symmetrical topology. The feed forward sections each include inverter pairs of PMOS and NMOS devices. The feedback sections each include a pair of cross-coupled devices. A pair of output nodes are operatively positioned between the pair of feedback sections. A method for using the circuit to generate output signals at respective output ports is also disclosed.

Abstract: A circuit device having a transistor-based switch topology that substantially eliminates the possibility of latchup of the device. A series-connected low voltage threshold (LVT) N-channel transistor and a pull-up resistor are coupled across a switching (P-channel) transistor so that an integral body connection is provided for the switching transistor, which connects the body of the switching transistor to a node between the pull-up resistor and source terminal of the LVT transistor. The LVT transistor is connected with its gate and drain terminal connected to the output terminal of the switching transistor. The resistor is connected at its other end to the power supply side terminal of the switching transistor. The addition of these components in the particular configuration allows the body connection of the switching transistor to be automatically switched to the highest potential diffusion node.

Abstract: Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: Method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: A clock distribution network, structure, and method for providing balanced loading is disclosed. In particular, a clock distribution network may be formed of one or more clock fanout distribution levels. Each respective distribution level may include an equal number of buffer circuits and wiring routes that have substantially identical physical and electrical properties. Additionally, a final distribution level may include wiring routes that have substantially identical physical and electrical properties connecting buffer circuits to one or more logic leaf connection nodes.

Abstract: Aspects of providing automatic adaptation to frequency offsets in high speed serial links are described. First signals for phase adjusts in a receiver link are adjusted by detecting trends in the first signals to generate second signals, the second signals improving a rate of compensation for the frequency offsets by the phase adjusts. An up/down counter is included for counting signals for phase adjustments by a clock-data-recovery loop of a serial receiver. An adder is coupled to the up/down counter and outputs accumulated data indicative of a trend in the phase adjustments. Combinatorial logic coupled to the adder adapts the signals based on the accumulated data.

Abstract: A method is provided for operating a transmitter integrated in a microelectronic element. In a calibration phase, a plurality of operational parameters are stored for controlling a frequency response of the transmitter under each of a plurality of corresponding operating conditions. Upon detecting an operating condition such as a temperature or power supply voltage level, the corresponding stored operational parameter is applied to the transmitter to control the frequency response.

Abstract: A high speed serial link method is provided, using a data driver and a replica driver structure, the replica driver structure comprising a replica driver, a calibration engine and a peak level detector. The calibration engine compares a peak level detector output to a reference value and responsively performs a data driver adjustment, wherein the data driver adjustment comprises at least one of a driver biasing adjustment, a driver intermediate stage bandwidth adjustment and a driver equalization setting adjustment. In some embodiments, the calibration engine incorporates a comparator and a digital state machine; in other embodiments, it incorporates an analog operational amplifier.

Abstract: A high speed serial link structure and method are provided, comprising a data driver and a replica driver structure, the replica driver structure comprising a replica driver, a calibration engine and a peak level detector. The calibration engine compares a peak level detector output to a reference value and responsively performs a data driver adjustment, wherein the data driver adjustment comprises at least one of a driver biasing adjustment, a driver intermediate stage bandwidth adjustment and a driver equalization setting adjustment. In some embodiments, the calibration engine incorporates a comparator and a digital state machine; in other embodiments, it incorporates an analog operational amplifier.

Abstract: Analog supply for an analog circuit and process for supplying an analog signal to an analog circuit. The analog supply includes a noise filter having a variable resistor, and a control device coupled to adjust the variable resistor. The control device is structured and arranged to set the resistance of the variable resistor to maximize noise filtering and optimize performance of the analog circuit.

Abstract: A method is provided for monitoring interconnect resistance within a semiconductor chip assembly. A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.

Abstract: Protection for the transmission of higher amplitude outputs required of differential amplifiers formed by thin oxide transistors with limited maximum voltage tolerance used where compliance with communication protocol standards requires handling voltages which may, in transition, exceed desirable levels is provided by limiting the voltage across any two device terminals under power down conditions.